Sputtering target for a physical vapor deposition chamber Patent Grant Savandaiah , et al. January 26, 2 [APPLIED MATERIALS, INC.]

Sputtering target for a physical vapor deposition chamber

Savandaiah , et al. January 26, 2

Patent Grant D908645

U.S. patent number D908,645 [Application Number D/703,194] was granted by the patent office on 2021-01-26 for sputtering target for a physical vapor deposition chamber. This patent grant is currently assigned to APPLIED MATERIALS, INC.. The grantee listed for this patent is APPLIED MATERIALS, INC.. Invention is credited to David Gunther, Siew Kit Hoi, Kirankumar Neelasandra Savandaiah.

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United States Patent	D908,645
Savandaiah , et al.	January 26, 2021

Sputtering target for a physical vapor deposition chamber

Claims

CLAIM We claim the ornamental design for a sputtering target for a physical vapor deposition chamber, as shown and described.

Inventors:

Savandaiah; Kirankumar Neelasandra (Karnataka, IN), Gunther; David (San Jose, CA), Hoi; Siew Kit (Singapore, SG)

Applicant:

Name	City	State	Country	Type
APPLIED MATERIALS, INC.	Santa Clara	CA	US

Assignee:

APPLIED MATERIALS, INC. (Santa Clara, CA)

Appl. No.:

D/703,194

Filed:

August 26, 2019

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182,184,199 ;D15/144.1,144.2,150,199 ;D23/213

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Other References

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Primary Examiner: Stout; Michael C
Assistant Examiner: Butac; Fritzgerald L
Attorney, Agent or Firm: Moser Taboada

Description

FIG. 1 is a top perspective view of a sputtering target for a physical vapor deposition chamber, according to one embodiment of the novel design.

FIG. 2 is a bottom perspective view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a right side plan view thereof.

FIG. 6 is a left side plan view thereof.

FIG. 7 is a front view thereof.

FIG. 8 is a back view thereof.

FIG. 9 is an enlarged cross sectional view taken along line 9-9 in FIG. 4.

FIG. 10 is a top perspective view of a sputtering target for a physical vapor deposition chamber, according to another embodiment of the novel design.

FIG. 11 is a bottom perspective view thereof.

FIG. 12 is a top plan view thereof.

FIG. 13 is a bottom plan view thereof.

FIG. 14 is a right side plan view thereof.

FIG. 15 is a left side plan view thereof.

FIG. 16 is a front view thereof.

FIG. 17 is a back view thereof; and,

FIG. 18 is an enlarged cross sectional view taken along line 18-18 in FIG. 13.

The broken lines show portions of a sputtering target for a physical vapor deposition chamber which form no part of the claimed design.

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References

Patent Diagrams and Documents