U.S. patent number D687,791 [Application Number D/416,236] was granted by the patent office on 2013-08-13 for multi-keyed wafer carrier.
This patent grant is currently assigned to Veeco Instruments Inc.. The grantee listed for this patent is Vadim Boguslavskiy, Alexander I. Gurary, Matthew King, Sandeep Krishnan, Steven Krommenhoek, Keng Moy. Invention is credited to Vadim Boguslavskiy, Alexander I. Gurary, Matthew King, Sandeep Krishnan, Steven Krommenhoek, Keng Moy.
United States Patent |
D687,791 |
Krishnan , et al. |
August 13, 2013 |
Multi-keyed wafer carrier
Claims
CLAIM The ornamental design for a multi-keyed wafer carrier, as
shown and described.
Inventors: |
Krishnan; Sandeep (Princeton,
NJ), Moy; Keng (Basking Ridge, NJ), Gurary; Alexander
I. (Bridgewater, NJ), King; Matthew (Montville, NJ),
Boguslavskiy; Vadim (Princeton, NJ), Krommenhoek; Steven
(Annandale, NJ) |
Applicant: |
Name |
City |
State |
Country |
Type |
Krishnan; Sandeep
Moy; Keng
Gurary; Alexander I.
King; Matthew
Boguslavskiy; Vadim
Krommenhoek; Steven |
Princeton
Basking Ridge
Bridgewater
Montville
Princeton
Annandale |
NJ
NJ
NJ
NJ
NJ
NJ |
US
US
US
US
US
US |
|
|
Assignee: |
Veeco Instruments Inc.
(Plainview, NY)
|
Appl.
No.: |
D/416,236 |
Filed: |
March 20, 2012 |
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182
;118/500,728,729 ;156/345.53 ;279/128 ;361/234
;451/287,288,289 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Lerner, David, Littenberg, Krumholz
& Mentlik, LLP
Description
FIG. 1 is a bottom perspective view of a multi-keyed wafer carrier
showing a first embodiment of our new design;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a bottom plan view of the first embodiment;
FIG. 4 is an enlarged view of a portion of FIG. 3;
FIG. 5 is a bottom perspective view of a multi-keyed wafer carrier
showing a second embodiment of our new design;
FIG. 6 is an enlarged view of a portion of FIG. 5;
FIG. 7 is a bottom plan view of the second embodiment;
FIG. 8 is an enlarged view of a portion of FIG. 7;
FIG. 9 is a bottom perspective view of a multi-keyed wafer carrier
showing a third embodiment of our new design;
FIG. 10 is an enlarged view of a portion of FIG. 9;
FIG. 11 is a bottom plan view of the third embodiment;
FIG. 12 is an enlarged view of a portion of FIG. 11;
FIG. 13 is a top perspective view that can correspond to any of the
first, second, or third embodiments;
FIG. 14 is a top plan view that can correspond to any of the first,
second, or third embodiments; and,
FIG. 15 is a right side view that can correspond to any of the
first, second, or third embodiments, the left side, front, and rear
views being the same as the right side view.
The dash-dot broken lines shown in the drawings define the area
corresponding to the enlarged portion shown in FIGS. 2, 4, 6, 8,
10, and 12 views and form no part of the claimed design.
* * * * *