Wafer carrier

Description

FIG. 1 is a perspective view of the first embodiment showing the claimed design;

FIG. 2 is a front elevational view of FIG. 1;

FIG. 3 is a rear elevational view of FIG. 1;

FIG. 4 is a right side elevational view of FIG. 1, which is a mirror image of the left side elevational view;

FIG. 5 is a bottom plan view of FIG. 1, which is a mirror image of the top plan view;

FIG. 6 is a perspective view of the second embodiment showing the claimed design;

FIG. 7 is a front elevational view of FIG. 6;

FIG. 8 is a rear elevational view of FIG. 6;

FIG. 9 is a right side elevational view of FIG. 6, which is a mirror image of the left side elevational view;

FIG. 10 is a bottom plan view of FIG. 6, which is a mirror image of the top plan view;

FIG. 11 is a perspective view of the third embodiment showing the claimed design;

FIG. 12 is a front elevational view of FIG. 11;

FIG. 13 is a rear elevational view of FIG. 11;

FIG. 14 is a right side elevational view of FIG. 11, which is a mirror image of the left side elevational view;

FIG. 15 is a bottom plan view of FIG. 11, which is a mirror image of the top plan view;

FIG. 16 is a perspective view of the fourth embodiment showing the claimed design;

FIG. 17 is a front elevational view of FIG. 16;

FIG. 18 is a rear elevational view of FIG. 16;

FIG. 19 is a right side elevational view of FIG. 16, which is a mirror image of the left side elevational view;

FIG. 20 is a bottom plan view of FIG. 16, which is a mirror image of the top plan view;

FIG. 21 is a perspective view of the fifth embodiment showing the claimed design;

FIG. 22 is a front elevational view of FIG. 21;

FIG. 23 is a rear elevational view of FIG. 21;

FIG. 24 is a right side elevational view of FIG. 21, which is a mirror image of the left side elevational view;

FIG. 25 is a bottom plan view of FIG. 21, which is a mirror image of the top plan view;

FIG. 26 is a perspective view of the sixth embodiment showing the claimed design;

FIG. 27 is a front elevational view of FIG. 26;

FIG. 28 is a rear elevational view of FIG. 26;

FIG. 29 is a right side elevational view of FIG. 26, which is a mirror image of the left side elevational view; and,

FIG. 30 is a bottom plan view of FIG. 26, which is a mirror image of the top plan view.

Claims

CLAIM The ornamental design for a "wafer carrier," as shown and described.

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Inventors:	Chang; Chung-Ying (Hsinchu, TW), Yang; Tzu-Ching (Hsinchu, TW), Chang; Chia-Sheng (Hsinchu, TW)
Applicant:	Name City State Country Type Chang; Chung-Ying Yang; Tzu-Ching Hsinchu Hsinchu N/A N/A TW TW
Assignee:	Epistar Corporation (Hsinchu, TW)
Appl. No.:	D/385,727
Filed:	February 18, 2011

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Foreign Application Priority Data

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Aug 19, 2010 [CN]			2010 3 0290123

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;118/500,728,729 ;156/345.53 ;279/128 ;361/234 ;451/287,288,289

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References Cited [Referenced By]

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U.S. Patent Documents

3731435	May 1973	Boettcher et al.
4165584	August 1979	Scherrer
5191738	March 1993	Nakazato et al.
5422316	June 1995	Desai et al.
6315649	November 2001	Hu et al.
6500059	December 2002	Chang et al.
6666948	December 2003	Nguyen
6988942	January 2006	Chen et al.
7235139	June 2007	Boguslavskiy et al.
D546784	July 2007	Hayashi
D548705	August 2007	Hayashi
D552565	October 2007	Nakamura et al.
8177993	May 2012	Seah et al.
8182315	May 2012	Nguyen
2002/0027762	March 2002	Yamaguchi
2003/0057089	March 2003	Nguyen
2004/0179323	September 2004	Litman et al.
2009/0247057	October 2009	Kobayashi et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Morris Manning & Martin LLP Xia, Esq.; Tim Tingkang