Holding pad for transferring a wafer

Description

FIG. 1 is a front view of a holding pad for transferring a wafer showing my new design.

FIG. 2 is a rear view of the holding pad for transferring a wafer of FIG. 1.

FIG. 3 is a top plan view of the holding pad for transferring a wafer of FIG. 1.

FIG. 4 is a bottom plan view of the holding pad for transferring a wafer of FIG. 1.

FIG. 5 is a right side view of the holding pad for transferring a wafer of FIG. 1.

FIG. 6 is a left side view of the holding pad for transferring a wafer of FIG. 1.

FIG. 7 is a perspective view of the holding pad for transferring a wafer of FIG. 1; and,

FIG. 8 is another front view of the holding pad for transferring a wafer of FIG. 1 shown in a used condition.

The features shown only in broken lines depict environmental subject matter only and form no part of the claimed design.

Claims

CLAIM The ornamental design for a holding pad for transferring a wafer, as shown and described.

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Inventors:	Osada; Hideyuki (Miyagi, JP)
Applicant:	Name City State Country Type Osada; Hideyuki Miyagi N/A JP
Assignee:	Tokyo Electron Limited (Tokyo, JP)
Appl. No.:	D/425,315
Filed:	June 21, 2012

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Foreign Application Priority Data

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Dec 22, 2011 [JP]			D2011-029878

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;118/500,724,725,728,729 ;414/217,222.01,416.03,935,936,937,938,939,940,941

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References Cited [Referenced By]

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U.S. Patent Documents

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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Leydig, Voit & Mayer, Ltd.