Wafer holding member

Kajiwara January 15, 2

Patent Grant D674366

U.S. patent number D674,366 [Application Number D/396,050] was granted by the patent office on 2013-01-15 for wafer holding member. This patent grant is currently assigned to Tokyo Electron Limited. The grantee listed for this patent is Hideki Kajiwara. Invention is credited to Hideki Kajiwara.


United States Patent D674,366
Kajiwara January 15, 2013

Wafer holding member

Claims

CLAIM The ornamental design for wafer holding member, as shown and described.
Inventors: Kajiwara; Hideki (Koshi, JP)
Applicant:
Name City State Country Type

Kajiwara; Hideki

Koshi

N/A

JP
Assignee: Tokyo Electron Limited (Minato-Ku, JP)
Appl. No.: D/396,050
Filed: June 24, 2011

Foreign Application Priority Data

Jan 20, 2011 [JP] 2011-001006
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;118/500,725,728,729 ;294/103.1 ;414/217,222.01,416.03,941

References Cited [Referenced By]

U.S. Patent Documents
4938166 July 1990 Joyce
5643366 July 1997 Somekh et al.
5851041 December 1998 Anderson et al.
5881668 March 1999 Begin et al.
6117238 September 2000 Begin
6244641 June 2001 Szapucki et al.
6267423 July 2001 Marohl et al.
6409453 June 2002 Brodine et al.
6491330 December 2002 Mankame et al.
6558562 May 2003 Mallery et al.
7100954 September 2006 Klein et al.
D589474 March 2009 Ogasawara et al.
D589912 April 2009 Ogasawara et al.
7644968 January 2010 Hirooka et al.
7694647 April 2010 Ishikawa et al.
D639253 June 2011 Tsai et al.
7980611 July 2011 Zenpo et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Burr & Brown

Description



FIG. 1 is front perspective view of a wafer holding member illustrating my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a front view thereof, the rear view being a mirror image;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a sectional view taken along line 7-7 of FIG. 2; and,

FIG. 8 is an enlarged view of portion 8 encircled in FIG. 7.

* * * * *


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