Electrode for a semiconductor processing apparatus Patent Grant Fukasawa October 24, 1 [Tokyo Electron Yamanashi Limited]

Electrode for a semiconductor processing apparatus

Fukasawa October 24, 1

Patent Grant D363464

U.S. patent number D363,464 [Application Number D/005,246] was granted by the patent office on 1995-10-24 for electrode for a semiconductor processing apparatus. This patent grant is currently assigned to Tokyo Electron Yamanashi Limited. Invention is credited to Kazuo Fukasawa.

United States Patent	D363,464
Fukasawa	October 24, 1995

Electrode for a semiconductor processing apparatus

Claims

The ornamental design for an electrode for a semiconductor processing apparatus, as shown and described.

Inventors:	Fukasawa; Kazuo (Nirasaki, JP)
Assignee:	Tokyo Electron Yamanashi Limited (Nirasaki, JP)
Appl. No.:	D/005,246
Filed:	February 26, 1993

Foreign Application Priority Data


Aug 27, 1992 [JP]			25414/92

Current U.S. Class:	D13/182
Field of Search:	;D13/182 ;156/345,643,646 ;437/228

Foreign Patent Documents


60-116126	Jun 1985	JP
60-169257	Nov 1985	JP
60-221578	Nov 1985	JP
61-171128	Aug 1986	JP
62-60875	Mar 1987	JP
62-252942	Nov 1987	JP
62-281427	Dec 1987	JP
325510	Apr 1991	JP
920077	Oct 1992	JP

Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt

Description

FIG. 1 is a front elevational view of an electrode for a semiconductor processing apparatus showing my new design;

FIG. 2 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;

FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is an enlarged cross-sectional view taken along line 5--5 of FIG. 1; and,

FIG. 6 is an enlarged cross-sectional view taken along line 6--6 of FIG. 1.

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