Elastic membrane for semiconductor wafer polishing apparatus

Description

FIG. 1 is a top perspective view a first embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a side view thereof, with the apparatus being radially symmetrical about a vertical axis;

FIG. 6 is a cross sectional view taken along section line 6-6 in FIG. 3;

FIG. 7 is an enlarged portion view taken along line 7-7 in FIG. 6;

FIG. 8 is a top perspective view a second embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 9 is a bottom perspective view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a side view thereof, with the apparatus being radially symmetrical about a vertical axis;

FIG. 13 is a cross sectional view taken along section line 13-13 in FIG. 10;

FIG. 14 is an enlarged portion view taken along line 14-14 in FIG. 13;

FIG. 15 is a top perspective view a third embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 16 is a bottom perspective view thereof;

FIG. 17 is a top plan view thereof;

FIG. 18 is a bottom plan view thereof;

FIG. 19 is a side view thereof, the apparatus being radially symmetrical about a vertical axis;

FIG. 20 is a cross sectional view taken along section line 20-20 in FIG. 17;

FIG. 21 is an enlarged portion view taken along line 21-21 in FIG. 20;

FIG. 22 is a top perspective view a fourth embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 23 is a bottom perspective view thereof;

FIG. 24 is a top plan view thereof;

FIG. 25 is a bottom plan view thereof;

FIG. 26 is a side view thereof, the apparatus being radially symmetrical about a vertical axis;

FIG. 27 is a cross sectional view taken along line 27-27 in FIG. 24; and,

FIG. 28 is an enlarged portion view taken along line 28-28 in FIG. 27.

The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design.

Claims

CLAIM The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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Inventors:	Fukushima; Makoto (Tokyo, JP), Yasuda; Hozumi (Tokyo, JP), Namiki; Keisuke (Tokyo, JP), Nabeya; Osamu (Tokyo, JP), Togashi; Shingo (Tokyo, JP), Yamaki; Satoru (Toyko, JP)
Applicant:	Name City State Country Type EBARA CORPORATION Tokyo N/A JP
Assignee:	EBARA CORPORATION (Tokyo, JP)
Appl. No.:	D/472,346
Filed:	November 12, 2013

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Foreign Application Priority Data

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May 15, 2013 [JP]			2013-10672
May 15, 2013 [JP]			2013-10673
May 15, 2013 [JP]			2013-10674
May 15, 2013 [JP]			2013-10675
May 15, 2013 [JP]			2013-10676
May 15, 2013 [JP]			2013-10677
May 15, 2013 [JP]			2013-10678

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;451/66,288,289

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References Cited [Referenced By]

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U.S. Patent Documents

6659850	December 2003	Korovin
7357699	April 2008	Togawa
7402098	July 2008	Severson
D616390	May 2010	Sato
D633452	March 2011	Namiki et al.
D634719	March 2011	Yasuda et al.
D649126	November 2011	Takahashi
D684551	June 2013	Nguyen
8469776	June 2013	Zuniga
D686175	July 2013	Gurary
D686582	July 2013	Krishnan
D687790	August 2013	Krishnan
D687791	August 2013	Krishnan
D711330	August 2014	Fukushima et al.
8859070	October 2014	Yasuda
D729753	May 2015	Fukushima et al.
2001/0029158	October 2001	Sasaki
2004/0175951	September 2004	Chen
2008/0070479	March 2008	Nabeya
2009/0068934	March 2009	Hong
2009/0068935	March 2009	Torii
2009/0111362	April 2009	Nabeya
2009/0247057	October 2009	Kobayashi
2013/0316628	November 2013	Jang

Foreign Patent Documents

	301348233		Sep 2010		CN
	301445758		Jan 2011		CN
	D 138225		Dec 2010		TW
	D 139857		Apr 2011		TW
	D 146491		Apr 2012		TW

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Pearne & Gordon LLP