U.S. patent number D813,181 [Application Number D/591,907] was granted by the patent office on 2018-03-20 for cover of seal cap for reaction chamber of semiconductor.
This patent grant is currently assigned to HITACHI KOKUSAI ELECTRIC INC.. The grantee listed for this patent is Hitachi Kokusai Electric Inc.. Invention is credited to Yusaku Okajima, Shuhei Saido, Mika Urushihara.
United States Patent |
D813,181 |
Okajima , et al. |
March 20, 2018 |
Cover of seal cap for reaction chamber of semiconductor
Claims
CLAIM The ornamental design for a cover of seal cap for reaction
chamber of semiconductor, as shown and described.
Inventors: |
Okajima; Yusaku (Toyama,
JP), Saido; Shuhei (Toyama, JP),
Urushihara; Mika (Toyama, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Hitachi Kokusai Electric Inc. |
Tokyo |
N/A |
JP |
|
|
Assignee: |
HITACHI KOKUSAI ELECTRIC INC.
(Tokyo, JP)
|
Appl.
No.: |
D/591,907 |
Filed: |
January 25, 2017 |
Foreign Application Priority Data
|
|
|
|
|
Jul 26, 2016 [JP] |
|
|
015868/2016 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182,184,162
;D10/49,50 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery,
LLP
Description
FIG. 1 is a front, top and right side perspective view of a cover
of seal cap for reaction chamber of semiconductor showing my new
design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a left side elevational view; and,
FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 4.
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