U.S. patent number D767,234 [Application Number D/519,122] was granted by the patent office on 2016-09-20 for wafer support ring.
This patent grant is currently assigned to Entegris, Inc.. The grantee listed for this patent is ENTEGRIS, INC.. Invention is credited to Eric A. Kirkland, Russ V. Raschke, Jason T. Steffens.
United States Patent |
D767,234 |
Kirkland , et al. |
September 20, 2016 |
Wafer support ring
Claims
CLAIM The ornamental design for a wafer support ring, as shown and
described.
Inventors: |
Kirkland; Eric A. (Colorado
Springs, CO), Raschke; Russ V. (Chanhassen, MN),
Steffens; Jason T. (Shakopee, MN) |
Applicant: |
Name |
City |
State |
Country |
Type |
ENTEGRIS, INC. |
Billerica |
MA |
US |
|
|
Assignee: |
Entegris, Inc. (Billerica,
MA)
|
Appl.
No.: |
D/519,122 |
Filed: |
March 2, 2015 |
Current U.S.
Class: |
D34/29 |
Current International
Class: |
1205 |
Field of
Search: |
;D34/29,28
;198/851,853,825,890.1,370.1,370.04,782,722,771,866,367,790
;193/35A,35C ;414/744.5,800 ;D23/269 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Ramirez; Cynthia
Attorney, Agent or Firm: Christensen Fonder P.A.
Description
FIG. 1 is a top perspective view of a wafer support ring showing
our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front elevational view, with the rear being a mirror
image thereof;
FIG. 6 is a cross sectional view taken at line 6-6 of FIG. 3;
and,
FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 3.
* * * * *