U.S. patent number D858,467 [Application Number D/609,639] was granted by the patent office on 2019-09-03 for power semiconductor module. This patent grant is currently assigned to ROHM CO., LTD.. The grantee listed for this patent is ROHM CO., LTD.. Invention is credited to Hideki Sawada.
United States Patent | D858,467 |
Sawada | September 3, 2019 |
Inventors: | Sawada; Hideki (Kyoto, JP) | ||||||||||
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Applicant: |
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Assignee: | ROHM CO., LTD. (Kyoto,
JP) |
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Appl. No.: | D/609,639 | ||||||||||
Filed: | July 3, 2017 |
Jan 5, 2017 [JP] | 2017-000032 | |||
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106 |
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