Semiconductor module

Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1;

FIG. 7 is a top, front, and right side perspective view of the semiconductor module of FIG. 1; and,

FIG. 8 is a cross sectional view taken along line 8-8 of FIG. 5.

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.

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Inventors:	Ikeda; Yoshinari (Matsumoto, JP), Hori; Motohito (Matsumoto, JP), Hinata; Yuichiro (Matsumoto, JP), Daicho; Norihiro (Matsumoto, JP)
Applicant:	Name City State Country Type FUJI ELECTRIC CO., LTD. Kawasaki N/A JP
Assignee:	FUJI ELECTRIC CO., LTD. (Kawasaki, JP)
Appl. No.:	D/601,253
Filed:	April 20, 2017

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Foreign Application Priority Data

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Oct 31, 2016 [JP]			2016-023736

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106

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References Cited [Referenced By]

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U.S. Patent Documents

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Primary Examiner: Oswecki; Elizabeth J