Semiconductor module

Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a front, right, and bottom perspective view thereof; and,

FIG. 8 is a rear, left, and top perspective view thereof.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. Rhombic plate members having rounded corners are centered along the long sides of the rear view, such that the longer diagonal line of each rhombic plate member extends along a long side.

The broken lines shown in the drawing views of FIGS. 1-8 form no part of the claimed design.

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.

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Inventors:	Soyano; Shin (Tokyo, JP), Takayima; Yoshikazu (Tokyo, JP), Higuchi; Keiichi (Tokyo, JP), Koyama; Takahiro (Tokyo, JP)
Applicant:	Name City State Country Type Fuji Electric Co., Ltd. Kawasaki-shi, Kanagawa N/A JP
Assignee:	Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa, JP)
Appl. No.:	D/528,214
Filed:	May 27, 2015

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Foreign Application Priority Data

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Nov 28, 2014 [JP]			D2014-026634
Nov 28, 2014 [JP]			D2014-026635
Nov 28, 2014 [JP]			D2014-026636

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182

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References Cited [Referenced By]

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U.S. Patent Documents

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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Young Basile Hanlon & MacFarlane, P.C.