Semiconductor device

Chen , et al. May 13, 2

Patent Grant D704671

U.S. patent number D704,671 [Application Number D/460,860] was granted by the patent office on 2014-05-13 for semiconductor device. This patent grant is currently assigned to Fuji Electric Co., Ltd.. The grantee listed for this patent is Fuji Electric Co., Ltd.. Invention is credited to Shuangching Chen, Takashi Hyakutake, Akira Iso, Syuuji Miyashita, Syougo Ogawa.


United States Patent D704,671
Chen ,   et al. May 13, 2014

Semiconductor device

Claims

CLAIM The ornamental design for a semiconductor device, as shown and described.
Inventors: Chen; Shuangching (Matsumoto, JP), Iso; Akira (Matsumoto, JP), Hyakutake; Takashi (Matsumoto, JP), Ogawa; Syougo (Matsumoto, JP), Miyashita; Syuuji (Matsumoto, JP)
Applicant:
Name City State Country Type

Fuji Electric Co., Ltd.

Kawasaki

N/A

JP
Assignee: Fuji Electric Co., Ltd. (Kanagawa, JP)
Appl. No.: D/460,860
Filed: July 16, 2013

Foreign Application Priority Data

Jan 24, 2013 [JP] D2013-001263
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/110,182 ;257/668,678,690 ;361/713,679.01,728,736,760,761,775,820 ;324/71.5,252 ;174/250,253 ;438/64,65,66

References Cited [Referenced By]

U.S. Patent Documents
D357672 April 1995 Terasawa et al.
D364383 November 1995 Yamada et al.
D364384 November 1995 Shimizu et al.
D432096 October 2000 Jeon et al.
D441726 May 2001 Sofue et al.
D470825 February 2003 Iwasaki et al.
6521983 February 2003 Yoshimatsu et al.
D476959 July 2003 Yamada et al.
D539761 April 2007 Takahashi et al.
D548202 August 2007 Takahashi
D548203 August 2007 Takahashi
D587662 March 2009 Soutome et al.
D589012 March 2009 Soyano et al.
D648290 November 2011 Mori
D653633 February 2012 Soyano
D653634 February 2012 Soyano
D673922 January 2013 Moriai et al.
D686174 July 2013 Soyano
D689446 September 2013 Soyano
2001/0038143 November 2001 Sonobe et al.
2011/0044012 February 2011 Matsumoto

Other References

US. Appl. No. 29/458,663, filed Jun. 21, 2013. cited by applicant .
U.S. Appl. No. 29/458,665, filed Jun. 21, 2013. cited by applicant .
U.S. Appl. No. 29/458,667, filed Jun. 21, 2013. cited by applicant .
U.S. Appl. No. 29/458,669, filed Jun. 21, 2013. cited by applicant.

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Young Basile Hanlon & MacFarlane P.C.

Description



FIG. 1 is a front view of a semiconductor device showing our new design;

FIG. 2 is a rear view of the semiconductor device of FIG. 1;

FIG. 3 is a left side view of the semiconductor device of FIG. 1;

FIG. 4 is a right side view of the semiconductor device of FIG. 1;

FIG. 5 is a top view of the semiconductor device of FIG. 1;

FIG. 6 is a bottom view of the semiconductor device of FIG. 1;

FIG. 7 is a top, front and right side perspective view of the semiconductor device of FIG. 1; and,

FIG. 8 is a top, rear and left side perspective view of the semiconductor device of FIG. 1.

The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

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