U.S. patent number D432,096 [Application Number D/117,449] was granted by the patent office on 2000-10-17 for semiconductor module.
This patent grant is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Jun-Young Jeon, Se-Yong Oh, Hai-Jeong Sohn, Young-Hee Song.
United States Patent |
D432,096 |
Jeon , et al. |
October 17, 2000 |
Semiconductor module
Claims
The ornamental design for a semiconductor module, as shown and
described.
Inventors: |
Jeon; Jun-Young (Seoul,
KR), Oh; Se-Yong (Seoul, KR), Sohn;
Hai-Jeong (Suwon, KR), Song; Young-Hee
(Kyungki-Do, KR) |
Assignee: |
Samsung Electronics Co., Ltd.
(Suwon, KR)
|
Appl.
No.: |
D/117,449 |
Filed: |
January 24, 2000 |
Foreign Application Priority Data
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|
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Nov 24, 1999 [KR] |
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99-28251 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182 ;174/52.4,52.5
;257/690 ;361/752,798,820 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Ladas & Parry
Description
FIG. 1 is a perspective view showing our design;
FIG. 2 is a front view thereof
FIG. 3 is a rear view thereof;
FIG. 4 is a right-hand side view thereof;
FIG. 5 is a left-hand side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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