| Patent | Date |
|---|
Substrate Inspection Device And Substrate Inspection Method
App 20200341049 - JUNG; Gu Hyun ; et al. | 2020-10-29 |
Method Of Manufacturing Decorative Flower
App 20170318882 - OH; Se Yong | 2017-11-09 |
Wafer level stack structure for system-in-package and method thereof
Grant 8,278,766 - Lee , et al. October 2, 2 | 2012-10-02 |
Wafer level stack structure for system-in-package and method thereof
App 20100320597 - Lee; Kang-Wook ; et al. | 2010-12-23 |
Method of forming metal lines and bumps for semiconductor devices
Grant 7,855,144 - Kim , et al. December 21, 2 | 2010-12-21 |
Wafer level stack structure for system-in-package and method thereof
Grant 7,824,959 - Lee , et al. November 2, 2 | 2010-11-02 |
Wafer level stack structure for system-in-package and method thereof
Grant 7,786,594 - Lee , et al. August 31, 2 | 2010-08-31 |
Fabrication method of wafer level chip scale packages
Grant 7,524,763 - Kim , et al. April 28, 2 | 2009-04-28 |
Lead on chip semiconductor package
Grant 7,414,303 - Lee , et al. August 19, 2 | 2008-08-19 |
Method of forming metal lines and bumps for semiconductor devices
App 20080076248 - Kim; Soon-bum ; et al. | 2008-03-27 |
Wafer level stack structure for system-in-package and method thereof
App 20070257350 - Lee; Kang-Wook ; et al. | 2007-11-08 |
Method Of Fabricating Ultra Thin Flip-chip Package
App 20070200251 - KIM; Soon-Bum ; et al. | 2007-08-30 |
Ultra-thin semiconductor package device and method for manufacturing the same
Grant 7,253,026 - Ahn , et al. August 7, 2 | 2007-08-07 |
Wafer level stack structure for system-in-package and method thereof
App 20070170576 - Lee; Kang-Wook ; et al. | 2007-07-26 |
Semiconductor Package Having Improved Solder Joint Reliability And Method Of Fabricating The Same
App 20070158843 - Kim; Shin ; et al. | 2007-07-12 |
Method of fabricating ultra thin flip-chip package
Grant 7,214,604 - Kim , et al. May 8, 2 | 2007-05-08 |
Wafer level stack structure for system-in-package and method thereof
Grant 7,215,033 - Lee , et al. May 8, 2 | 2007-05-08 |
Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the same
App 20070096338 - Kim; Shin ; et al. | 2007-05-03 |
Stacked chip package having upper chip provided with trenches and method of manufacturing the same
Grant 7,115,483 - Kwon , et al. October 3, 2 | 2006-10-03 |
Semiconductor package
Grant 7,078,800 - Kwon , et al. July 18, 2 | 2006-07-18 |
Ultra-thin semiconductor package device and method for manufacturing the same
App 20060110858 - Ahn; Sang-Ho ; et al. | 2006-05-25 |
Ultra-thin semiconductor package device and method for manufacturing the same
Grant 7,012,325 - Ahn , et al. March 14, 2 | 2006-03-14 |
High-reliability solder joint for printed circuit board and semiconductor package module using the same
App 20050282315 - Jeong, Se-Young ; et al. | 2005-12-22 |
Fabrication method of wafer level chip scale packages
App 20050277293 - Kim, Soon-Bum ; et al. | 2005-12-15 |
Solder bump structure and method for forming a solder bump
Grant 6,959,856 - Oh , et al. November 1, 2 | 2005-11-01 |
Semiconductor package
Grant 6,952,050 - Kwon , et al. October 4, 2 | 2005-10-04 |
Lead on chip semiconductor package
App 20050212099 - Lee, Sang-Hyeop ; et al. | 2005-09-29 |
Solder bump structure and method for forming a solder bump
App 20050208751 - Oh, Se-Yong ; et al. | 2005-09-22 |
Memory card having a control chip
Grant 6,943,438 - Son , et al. September 13, 2 | 2005-09-13 |
Flip chip device having supportable bar and mounting structure thereof
App 20050104222 - Jeong, Se-Young ; et al. | 2005-05-19 |
Wafer level stack structure for system-in-package and method thereof
App 20050104181 - Lee, Kang-Wook ; et al. | 2005-05-19 |
Method of fabricating ultra thin flip-chip package
App 20050090090 - Kim, Soon-Bum ; et al. | 2005-04-28 |
Semiconductor package
App 20050056928 - Kwon, Heung-Kyu ; et al. | 2005-03-17 |
Stacked chip package having upper chip provided with trenches and method of manufacturing the same
App 20050051882 - Kwon, Yong Hwan ; et al. | 2005-03-10 |
Stacked chip package having upper chip provided with trenches and method of manufacturing the same
Grant 6,818,998 - Kwon , et al. November 16, 2 | 2004-11-16 |
Semiconductor package and package stack made thereof
Grant 6,812,567 - Kim , et al. November 2, 2 | 2004-11-02 |
Solder bump structure and method for forming a solder bump
App 20040134974 - Oh, Se-Yong ; et al. | 2004-07-15 |
Semiconductor package and package stack made thereof
App 20040104474 - Kim, Jin-Ho ; et al. | 2004-06-03 |
Memory card
App 20030197261 - Son, Min-Young ; et al. | 2003-10-23 |
Semiconductor package
App 20030067070 - Kwon, Heung-Kyu ; et al. | 2003-04-10 |
Stacked chip package having upper chip provided with trenches and method of manufacturing the same
App 20030001281 - Kwon, Yong Hwan ; et al. | 2003-01-02 |
Water-soluble polymeric adhesion promoter and production method
App 20020161151 - Oh, Se Yong ; et al. | 2002-10-31 |
Ultra-thin semiconductor package device and method for manufacturing the same
App 20020121680 - Ahn, Sang-Ho ; et al. | 2002-09-05 |
Semiconductor package using tape circuit board with a groove for preventing encapsulant from overflowing and manufacturing method thereof
App 20020119595 - Kim, Shin ; et al. | 2002-08-29 |
Water-soluble polymeric adhesion promoter and production method
App 20020035222 - Oh, Se Yong ; et al. | 2002-03-21 |
Method for manufacturing a chip scale package having slits formed on a substrate
App 20010053563 - Kim, Shin ; et al. | 2001-12-20 |
Semiconductor module
Grant D432,096 - Jeon , et al. October 17, 2 | 2000-10-17 |
Semiconductor package
Grant D432,097 - Song , et al. October 17, 2 | 2000-10-17 |
Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same
Grant 5,897,339 - Song , et al. April 27, 1 | 1999-04-27 |
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