Semiconductor

Takahashi August 7, 2

Patent Grant D548203

U.S. patent number D548,203 [Application Number D/264,892] was granted by the patent office on 2007-08-07 for semiconductor. This patent grant is currently assigned to Kabushiki Kaisha Toshiba. Invention is credited to Ichiro Takahashi.


United States Patent D548,203
Takahashi August 7, 2007

Semiconductor

Claims

CLAIM The ornamental design for a semiconductor, as shown and described.
Inventors: Takahashi; Ichiro (Suginami-ku, JP)
Assignee: Kabushiki Kaisha Toshiba (JP)
Appl. No.: D/264,892
Filed: August 22, 2006

Foreign Application Priority Data

Apr 17, 2006 [JP] 2006-009885
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/133,146-147,149,154,182,184 ;174/250,253 ;257/666,694,696,820 ;381/760

References Cited [Referenced By]

U.S. Patent Documents
D288922 March 1987 Olla
D357462 April 1995 Terasawa et al.
D358806 May 1995 Siegel et al.
D359028 June 1995 Siegel et al.
5557504 September 1996 Siegel et al.
D397092 August 1998 Sano et al.
D401912 December 1998 Majumdar et al.
D448739 October 2001 Iwasaki et al.
D505399 May 2005 Yoshida et al.
D505400 May 2005 Kawafuji et al.
2003/0042584 March 2003 Yamaguchi
Foreign Patent Documents
D801093 Nov 1990 JP
D946124 Feb 1996 JP
D982886 Jun 1997 JP
D106269 Sep 2005 TW
Primary Examiner: Bui; Daniel
Attorney, Agent or Firm: Banner & Witcoff, Ltd.

Description



FIG. 1 is a bottom, front and left side perspective view of a semiconductor showing my new design,

FIG. 2 is a front elevational view thereof,

FIG. 3 is a rear elevational view thereof,

FIG. 4 is a right side elevational view thereof,

FIG. 5 is a right side elevational view thereof,

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

* * * * *


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