U.S. patent number D359,028 [Application Number D/012,499] was granted by the patent office on 1995-06-06 for socketed integrated circuit package. This patent grant is currently assigned to SGS-Thomson Microelectronics, Inc.. Invention is credited to Michael J. Hundt, Krishnan Kelappan, Harry M. Siegel.
United States Patent | D359,028 |
Siegel , et al. | * June 6, 1995 |
Inventors: | Siegel; Harry M. (Hurst, TX), Hundt; Michael J. (Double Oak, TX), Kelappan; Krishnan (Carrollton, TX) |
---|---|
Assignee: | SGS-Thomson Microelectronics,
Inc. (Carrollton, TX) |
[*] Notice: | The portion of the term of this patent subsequent to May 30, 2009 has been disclaimed. |
Appl. No.: | D/012,499 |
Filed: | September 2, 1993 |
Current U.S. Class: | D13/182 |
Field of Search: | ;D13/125,182 ;174/52.1,52.4 ;439/55,70 ;361/718,820 ;257/678,723,730,731 |
D82797 | December 1930 | Cole |
D317592 | June 1991 | Yoshizawa |
3762039 | October 1973 | Douglass et al. |
3891898 | June 1975 | Damon |
4422703 | December 1983 | Christensen et al. |
4868349 | September 1989 | Chia |
5119269 | June 1992 | Nakayama |
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