Siegel; Harry M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Siegel; Harry M..The latest application filed is for "leadframeless package structure and method".

Company Profile

0.11.10

Siegel; Harry M. - Hurst TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Leadframeless package structure and method App 20060261450 - Siegel; Harry M. ; et al.	2006-11-23
Leadframeless package structure and method App 20040200062 - Siegel, Harry M. ; et al.	2004-10-14
Leadframeless package structure and method Grant 6,769,174 - Siegel , et al. August 3, 2	2004-08-03
Fingerprint sensor having a portion of the fluorocarbon polymer physical interface layer amorphized Grant 6,762,470 - Siegel , et al. July 13, 2	2004-07-13
Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particles Grant 6,759,326 - Siegel , et al. July 6, 2	2004-07-06
Selective ionic implantation of fluoropolymer film to modify the sensitivity of underlying sensing capacitors Grant 6,707,093 - Siegel , et al. March 16, 2	2004-03-16
Integrated circuit device with exposed upper and lower die surfaces Grant 6,700,190 - Siegel , et al. March 2, 2	2004-03-02
Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particles App 20040038515 - Siegel, Harry M. ; et al.	2004-02-26
Capacitive fingerprint sensor with protective coating containing a conductive suspension Grant 6,693,441 - Lane , et al. February 17, 2	2004-02-17
Leadframeless package structure and method App 20040017668 - Siegel, Harry M. ; et al.	2004-01-29
Integrated Circuit Device With Exposed Upper And Lower Die Surfaces App 20040017002 - Siegel, Harry M. ; et al.	2004-01-29
Use of fluoropolymer coating for planarizing and passivating integrated circuit devices App 20030199147 - Siegel, Harry M. ; et al.	2003-10-23
Use Of Fluoropolymer Coating For Planarizing And Passivating Integrated Circuit Devices App 20030104693 - Siegel, Harry M. ; et al.	2003-06-05
Selective ionic implantation of fluoropolymer film to modify the sensitivity of underlying sensing capacitors App 20030104647 - Siegel, Harry M. ; et al.	2003-06-05
Capacitive fingerprint sensor with protective coating containing a conductive suspension App 20030102874 - Lane, Fred P. ; et al.	2003-06-05
Protection of exposed semiconductor chip using thin polymer coatings App 20030102533 - Siegel, Harry M. ; et al.	2003-06-05
Ball grid array package with detachable module Grant 5,642,265 - Bond , et al. June 24, 1	1997-06-24
Surface mountable integrated circuit package with detachable module Grant 5,557,504 - Siegel , et al. September 17, 1	1996-09-17
Molded package integrated circuit with electrochemical cell Grant 5,451,715 - Hundt , et al. September 19, 1	1995-09-19
Socketed integrated circuit package Grant D359,028 - Siegel , et al. * June 6, 1	1995-06-06
Socketed integrated circuit package Grant D358,806 - Siegel , et al. May 30, 1	1995-05-30

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