| Patent | Date |
|---|
Integrated circuit package including embedded thin-film battery
Grant 9,012,264 - Hundt , et al. April 21, 2 | 2015-04-21 |
Integrated Circuit Package Including Embedded Thin-film Battery
App 20140315334 - Hundt; Michael J. ; et al. | 2014-10-23 |
Integrated circuit package including embedded thin-film battery
Grant 8,766,435 - Hundt , et al. July 1, 2 | 2014-07-01 |
Method of packaging integrated circuits
Grant 8,163,220 - Hundt , et al. April 24, 2 | 2012-04-24 |
Ball Grid Array Package
App 20100019374 - Hundt; Michael J. | 2010-01-28 |
Thin-film Battery Equipment
App 20090278503 - Hundt; Michael J. ; et al. | 2009-11-12 |
Mold with compensating base
App 20080290557 - Hundt; Michael J. ; et al. | 2008-11-27 |
Molded integrated circuit package with exposed active area
Grant 7,402,454 - Zhou , et al. July 22, 2 | 2008-07-22 |
Thermally-enhanced ball grid array package structure and method
Grant 7,315,079 - Zhou , et al. January 1, 2 | 2008-01-01 |
Molded integrated circuit package with exposed active area
Grant 7,304,362 - Zhou , et al. December 4, 2 | 2007-12-04 |
Thermally-enhanced ball grid array package structure and method
App 20070200224 - Zhou; Tiao ; et al. | 2007-08-30 |
Apparatus and method for attaching an integrating circuit sensor to a substrate
Grant 7,244,967 - Hundt , et al. July 17, 2 | 2007-07-17 |
Molded integrated circuit package with exposed active area
App 20070085222 - Zhou; Tiao ; et al. | 2007-04-19 |
Thermally-enhanced ball grid array package structure and method
Grant 7,180,175 - Zhou , et al. February 20, 2 | 2007-02-20 |
Integrated circuit package including embedded thin-film battery
App 20060001137 - Hundt; Michael J. ; et al. | 2006-01-05 |
Mold with compensating base
App 20050082718 - Hundt, Michael J. ; et al. | 2005-04-21 |
Apparatus and method for attaching an integrated circuit sensor to a substrate
App 20040241905 - Hundt, Michael J. ; et al. | 2004-12-02 |
Mold with compensating base
Grant 6,817,854 - Hundt , et al. November 16, 2 | 2004-11-16 |
Apparatus and method for attaching an integrated circuit sensor to a substrate
Grant 6,815,262 - Hundt , et al. November 9, 2 | 2004-11-09 |
Thin-film battery equipment
App 20040081860 - Hundt, Michael J. ; et al. | 2004-04-29 |
Method and system for exposed die molding for integrated circuit packaging
Grant 6,686,227 - Zhou , et al. February 3, 2 | 2004-02-03 |
Apparatus and method for attaching an integrated circuit sensor to a substrate
App 20040012084 - Hundt, Michael J. ; et al. | 2004-01-22 |
Molded integrated circuit package with exposed active area
App 20030214021 - Zhou, Tiao ; et al. | 2003-11-20 |
Mold with compensating base
App 20030214074 - Hundt, Michael J. ; et al. | 2003-11-20 |
Lead-frame forming for improved thermal performance
App 20030151120 - Hundt, Michael J. ; et al. | 2003-08-14 |
Thermally-enhanced ball grid array package structure and method
App 20030146507 - Zhou, Tiao ; et al. | 2003-08-07 |
Method and system for exposed die molding for integrated circuit packaging
App 20030148556 - Zhou, Tiao ; et al. | 2003-08-07 |
Packaging for silicon sensors
Grant 6,028,773 - Hundt February 22, 2 | 2000-02-22 |
Ball grid array integrated circuit package with high thermal conductivity
Grant 5,991,156 - Bond , et al. November 23, 1 | 1999-11-23 |
Low-profile socketed packaging system with land-grid array and thermally conductive slug
Grant 5,805,419 - Hundt , et al. September 8, 1 | 1998-09-08 |
Ball grid array integrated circuit package with high thermal conductivity
Grant 5,693,572 - Bond , et al. December 2, 1 | 1997-12-02 |
Low-profile socketed packaging system with land-grid array and thermally conductive slug
Grant 5,677,247 - Hundt , et al. October 14, 1 | 1997-10-14 |
Ball-grid-array integrated circuit package with solder-connected thermal conductor
Grant 5,642,261 - Bond , et al. June 24, 1 | 1997-06-24 |
Process for dissipating heat from a semiconductor package
Grant 5,590,462 - Hundt , et al. January 7, 1 | 1997-01-07 |
Surface mountable integrated circuit package with detachable module
Grant 5,557,504 - Siegel , et al. September 17, 1 | 1996-09-17 |
Surface mountable integrated circuit package with integrated battery mount
Grant 5,498,903 - Dixon , et al. March 12, 1 | 1996-03-12 |
Integrated circuit package with flat-topped heat sink
Grant 5,461,257 - Hundt October 24, 1 | 1995-10-24 |
Molded package integrated circuit with electrochemical cell
Grant 5,451,715 - Hundt , et al. September 19, 1 | 1995-09-19 |
Socketed integrated circuit package
Grant D359,028 - Siegel , et al. * June 6, 1 | 1995-06-06 |
Socketed integrated circuit package
Grant D358,806 - Siegel , et al. May 30, 1 | 1995-05-30 |
Surface mountable integrated circuit package with integrated battery mount
Grant 5,403,782 - Dixon , et al. April 4, 1 | 1995-04-04 |
IC package having direct attach backup battery
Grant 5,294,829 - Hundt March 15, 1 | 1994-03-15 |
IC package having replaceable backup battery
Grant 5,289,034 - Hundt February 22, 1 | 1994-02-22 |
Circuit assembly having interposer lead frame
Grant 5,283,717 - Hundt February 1, 1 | 1994-02-01 |
Integrated circuit package with molded cell
Grant 5,196,374 - Hundt , et al. March 23, 1 | 1993-03-23 |
Integrated circuit package with molded cell
Grant 5,124,782 - Hundt , et al. June 23, 1 | 1992-06-23 |
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