Semiconductor device

Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.

Claims

The ornamental design for a semiconductor device, as shown and described.

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Inventors:	Yoshida; Hiroshi (Fukuoka, JP), Kawafuji; Hisashi (Fukuoka, JP)
Assignee:	Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP)
Appl. No.:	D/180,822
Filed:	May 1, 2003

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Foreign Application Priority Data

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Mar 14, 2003 [JP]			2003-006770

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;174/52.1,52.2,52.4 ;257/666,669,675,676,678,690,692,696,697,730,787 ;361/773,820 ;438/64,65

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References Cited [Referenced By]

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U.S. Patent Documents

3762039	October 1973	Douglass et al.
D360619	July 1995	Terasawa et al.
D394244	May 1998	Majumdar et al.
D401912	December 1998	Majumdar et al.
D448739	October 2001	Iwasaki et al.
D470825	February 2003	Iwasaki et al.

Foreign Patent Documents

	982886		Jun 1997		JP

Primary Examiner: Reid; Stella
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.