Kawafuji; Hisashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kawafuji; Hisashi.The latest application filed is for "power module".
Company Profile
0.35.13
- Kawafuji; Hisashi - Tokyo JP
- Kawafuji; Hisashi - Fukuoka JP
- Kawafuji, Hisashi - Fukuoka-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Power module Grant 10,796,979 - Hasegawa , et al. October 6, 2 | 2020-10-06 |
| Method for manufacturing power module Grant 10,332,869 - Ikeda , et al. | 2019-06-25 |
| Power Module App 20190115283 - HASEGAWA; Maki ; et al. | 2019-04-18 |
| Method For Manufacturing Power Module App 20170236812 - IKEDA; Naoki ; et al. | 2017-08-17 |
| Power module and control integrated circuit Grant 9,716,058 - Ikeda , et al. July 25, 2 | 2017-07-25 |
| Power semiconductor device Grant D783,550 - Hasegawa , et al. April 11, 2 | 2017-04-11 |
| Power semiconductor device Grant D777,124 - Hasegawa , et al. January 24, 2 | 2017-01-24 |
| Power semiconductor device Grant D772,182 - Hasegawa , et al. November 22, 2 | 2016-11-22 |
| Power semiconductor device Grant D770,994 - Hasegawa , et al. November 8, 2 | 2016-11-08 |
| Semiconductor device and method of manufacturing the same Grant 9,324,685 - Zhang , et al. April 26, 2 | 2016-04-26 |
| Semiconductor Device And Method Of Manufacturing The Same App 20160064353 - ZHANG; Hongbo ; et al. | 2016-03-03 |
| Semiconductor device Grant 9,230,891 - Zhang , et al. January 5, 2 | 2016-01-05 |
| Power Module And Method For Manufacturing The Same App 20150155228 - IKEDA; Naoki ; et al. | 2015-06-04 |
| Semiconductor Device And Method Of Manufacturing The Same App 20150084173 - ZHANG; Hongbo ; et al. | 2015-03-26 |
| Semiconductor device and mold for resin-molding semiconductor device Grant 7,808,085 - Ozaki , et al. October 5, 2 | 2010-10-05 |
| Method for producing semiconductor device and semiconductor device Grant 7,781,262 - Hayashi , et al. August 24, 2 | 2010-08-24 |
| Semiconductor device and method for producing the same Grant 7,671,453 - Hayashi , et al. March 2, 2 | 2010-03-02 |
| Semiconductor device and semiconductor assembly module with a gap-controlling lead structure Grant 7,361,983 - Hayashi , et al. April 22, 2 | 2008-04-22 |
| Semiconductor device and mold for resin-molding semiconductor device App 20070132112 - Ozaki; Hiroyuki ; et al. | 2007-06-14 |
| Method for producing semiconductor device and semiconductor device App 20070042531 - Hayashi; Kenichi ; et al. | 2007-02-22 |
| Method for producing semiconductor device and semiconductor device Grant 7,166,926 - Hayashi , et al. January 23, 2 | 2007-01-23 |
| Semiconductor device Grant D505,399 - Yoshida , et al. May 24, 2 | 2005-05-24 |
| Semiconductor device Grant D505,400 - Kawafuji , et al. May 24, 2 | 2005-05-24 |
| Method for producing semiconductor device and semiconductor device App 20050082690 - Hayashi, Kenichi ; et al. | 2005-04-21 |
| Semiconductor device and method for producing the same App 20050067719 - Hayashi, Kenichi ; et al. | 2005-03-31 |
| Inverter module having a plurality of terminals at a predetermined pitch Grant 6,794,742 - Kawafuji , et al. September 21, 2 | 2004-09-21 |
| Resin-molded device and manufacturing apparatus thereof Grant 6,791,167 - Hayashi , et al. September 14, 2 | 2004-09-14 |
| Semiconductor device and semiconductor assembly module App 20040145043 - Hayashi, Kenichi ; et al. | 2004-07-29 |
| Semiconductor device Grant 6,734,551 - Yoshihara , et al. May 11, 2 | 2004-05-11 |
| Resin-molded device and manufacturing apparatus thereof App 20030183907 - Hayashi, Kenichi ; et al. | 2003-10-02 |
| Semiconductor unit Grant 6,603,197 - Yoshida , et al. August 5, 2 | 2003-08-05 |
| Semiconductor device App 20030075783 - Yoshihara, Hiroyuki ; et al. | 2003-04-24 |
| Semiconductor device Grant D472,530 - Iwasaki , et al. April 1, 2 | 2003-04-01 |
| Semiconductor device Grant D470,824 - Iwasaki , et al. February 25, 2 | 2003-02-25 |
| Semiconductor device Grant D470,825 - Iwasaki , et al. February 25, 2 | 2003-02-25 |
| Semiconductor device Grant D470,463 - Iwasaki , et al. February 18, 2 | 2003-02-18 |
| Inverter module App 20030006434 - Kawafuji, Hisashi ; et al. | 2003-01-09 |
| Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon Grant 6,313,520 - Yoshida , et al. November 6, 2 | 2001-11-06 |
| Semiconductor device Grant D448,740 - Iwasaki , et al. October 2, 2 | 2001-10-02 |
| Semiconductor device Grant D428,859 - Kawafuji , et al. August 1, 2 | 2000-08-01 |
| Semiconductor device Grant D421,969 - Kawafuji , et al. March 28, 2 | 2000-03-28 |
| Semiconductor device Grant D418,485 - Kawafuji , et al. January 4, 2 | 2000-01-04 |
| Semiconductor device Grant 6,002,166 - Noda , et al. December 14, 1 | 1999-12-14 |
| Semiconductor device Grant 5,998,856 - Noda , et al. December 7, 1 | 1999-12-07 |
| Semiconductor device Grant D401,912 - Majumdar , et al. December 1, 1 | 1998-12-01 |
| Semiconductor device and semiconductor module Grant 5,773,883 - Majumdar , et al. June 30, 1 | 1998-06-30 |
| Semiconductor device Grant D394,244 - Majumdar , et al. May 12, 1 | 1998-05-12 |
| Semiconductor device and semiconductor module Grant 5,747,876 - Majumdar , et al. May 5, 1 | 1998-05-05 |
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