U.S. patent number D777,124 [Application Number D/568,598] was granted by the patent office on 2017-01-24 for power semiconductor device.
This patent grant is currently assigned to Mitsubishi Electric Corporation. The grantee listed for this patent is MITSUBISHI ELECTRIC CORPORATION. Invention is credited to Maki Hasegawa, Toru Iwagami, Masahiro Kato, Hisashi Kawafuji, Shinya Nakagawa.
United States Patent |
D777,124 |
Hasegawa , et al. |
January 24, 2017 |
Power semiconductor device
Claims
CLAIM The ornamental design for a power semiconductor device, as
shown and described.
Inventors: |
Hasegawa; Maki (Tokyo,
JP), Kato; Masahiro (Tokyo, JP), Nakagawa;
Shinya (Tokyo, JP), Kawafuji; Hisashi (Tokyo,
JP), Iwagami; Toru (Tokyo, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
MITSUBISHI ELECTRIC CORPORATION |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Mitsubishi Electric Corporation
(Tokyo, JP)
|
Appl.
No.: |
D/568,598 |
Filed: |
June 20, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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29503649 |
Sep 29, 2014 |
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Foreign Application Priority Data
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Apr 2, 2014 [JP] |
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2014-007263 |
Apr 2, 2014 [JP] |
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2014-007264 |
Apr 2, 2014 [JP] |
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2014-007265 |
Apr 2, 2014 [JP] |
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2014-007266 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Studebaker & Brackett PC
Description
FIG. 1 is a front, right side, bottom perspective view of a power
semiconductor device showing our new design;
FIG. 2 is a rear, left side, top perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines shown represent unclaimed subject matter of a
power semiconductor device and form no part of the claimed
design.
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