Semiconductor device

Description

FIG. 1 is a front elevational view of a semiconductor device, showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is an enlarged cross-sectional view thereof, taken along line 7-7 in FIG. 1;

FIG. 8 is an enlarged cross-sectional view thereof, taken along line 8-8 in FIG. 1; and,

FIG. 9 is a front, right side and bottom perspective view thereof.

Claims

The ornamental design for a semiconductor device, as shown and described.

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Inventors:	Kawafuji; Hisashi (Tokyo, JP), Iwasaki; Mitsutaka (Tokyo, JP), Majumdar; Gourab (Tokyo, JP), Shinohara; Toshiaki (Tokyo, JP)
Assignee:	Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP)
Appl. No.:	D/100,732
Filed:	February 17, 1999

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Foreign Application Priority Data

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Sep 29, 1998 [JP]			10-27739

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;174/52.4,525 ;257/690 ;361/752,798,820

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References Cited [Referenced By]

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U.S. Patent Documents

D317592	June 1991	Yoshizawa
D359028	June 1995	Siegel et al.
D360619	July 1995	Terasawa et al.
D394244	May 1998	Majumdar et al.
D396213	July 1998	Enomoto et al.
D397092	August 1998	Sano et al.
D401912	December 1998	Majumdar et al.
5089929	February 1992	Hilland

Primary Examiner: Vinson; Brian N.
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.