Integrated circuit package
Sano , et al. August 18, 1
U.S. patent number D397,092 [Application Number D/064,520] was granted by the patent office on 1998-08-18 for integrated circuit package. This patent grant is currently assigned to Fujitsu Limited. Invention is credited to Takahisa Kawai, Yoshiaki Sano, Masahisa Suzuki, Takashi Yoshida.
| United States Patent | D397,092 |
| Sano , et al. | August 18, 1998 |
Integrated circuit package
Claims
The ornamental design for an integrated circuit package, as shown.
| Inventors: | Sano; Yoshiaki (Kawasaki, JP), Yoshida; Takashi (Kawasaki, JP), Kawai; Takahisa (Kawasaki, JP), Suzuki; Masahisa (Kawasaki, JP) |
|---|---|
| Assignee: | Fujitsu Limited (Kawasaki,
JP) |
| Appl. No.: | D/064,520 |
| Filed: | January 3, 1997 |
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182,110 ;174/16.3,52.2-52.4 ;257/666,678-697,700,730 ;361/773,792,813 ;439/68,70 |
References Cited [Referenced By]
U.S. Patent Documents
| D260091 | August 1981 | Mochizuki et al. |
| D345731 | April 1994 | Owens et al. |
| D358806 | May 1995 | Siegel et al. |
| D363056 | October 1995 | Vinciarelli et al. |
| 5570273 | October 1996 | Siegel et al. |
Assistant Examiner: Matta; Cathron B.
Attorney, Agent or Firm: Staas & Halsey
Description
FIG. 1 is a front elevational view of our new integrated circuit package;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a perspective view thereof.
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