Socketed integrated circuit package

Description

FIG. 1 is a perspective view of the integrated circuit package;

FIG. 2 is a side elevation view of the integrated circuit package;

FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;

FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;

FIG. 5 is a top plan view of the integrated circuit package; and,

FIG. 6 is a bottom plan view of the integrated circuit package.

Claims

The ornamental design for the socketed integrated circuit package, as shown and described.

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Inventors:	Siegel; Harry M. (Hurst, TX), Hundt; Michael J. (Double Oak, TX), Kelappan; Krishnan (Carrollton, TX)
Assignee:	SGS-Thomson Microelectronics, Inc. (Carrollton, TX)
Appl. No.:	D/013,438
Filed:	September 24, 1993

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Current U.S. Class:	D13/182
Field of Search:	;D13/125,182 ;174/52.1,52.4 ;439/55,70 ;361/718,820 ;257/678,723,730,731

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References Cited [Referenced By]

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U.S. Patent Documents

D82797	December 1930	Cole
D317592	June 1991	Yoshizawa
3762039	October 1973	Douglass et al.
3891898	June 1975	Damon
4422703	December 1983	Christensen et al.
4868349	September 1989	Chia
5119269	June 1992	Nakayama

Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Anderson; Rodney M. Jorgenson; Lisa K. Robinson; Richard K.