U.S. patent number D717,256 [Application Number D/450,512] was granted by the patent office on 2014-11-11 for semiconductor device.
This patent grant is currently assigned to Samsung Electro-Mechanics Co., Ltd.. The grantee listed for this patent is Samsung Electro-Mechanics Co., Ltd.. Invention is credited to Job Ha, Jang Man Kim, Hyo Jin Lee, Suk Ho Lee, Kyu Hwan Oh, Sung Man Pang, Jae Hoon Park, Young Ho Sohn, Sun Woo Yun.
United States Patent |
D717,256 |
Sohn , et al. |
November 11, 2014 |
Semiconductor device
Claims
CLAIM The ornamental design for a semiconductor device, as shown
and described.
Inventors: |
Sohn; Young Ho (Gyunggi-do,
KR), Ha; Job (Gyunggi-do, KR), Kim; Jang
Man (Gyunggi-do, KR), Pang; Sung Man (Gyunggi-do,
KR), Yun; Sun Woo (Gyunggi-do, KR), Lee;
Suk Ho (Gyunggi-do, KR), Lee; Hyo Jin
(Gyunggi-do, KR), Oh; Kyu Hwan (Gyunggi-do,
KR), Park; Jae Hoon (Gyunggi-do, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electro-Mechanics Co., Ltd. |
Gyunggi-do |
N/A |
KR |
|
|
Assignee: |
Samsung Electro-Mechanics Co.,
Ltd. (Suwon, Gyunggi-Do, KR)
|
Appl.
No.: |
D/450,512 |
Filed: |
March 18, 2013 |
Foreign Application Priority Data
|
|
|
|
|
Sep 20, 2012 [KR] |
|
|
30-2012-0045473 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/110,182,184
;361/713,728,736,760,761,775,679.01,820 ;257/666,668,678,684,690
;324/71.5,252 ;174/250,253 ;438/64,656,66 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Japanese Office Action issued in Japanese Design Application No.
2013-006143 dated Jul. 16, 2013 with English Translation. cited by
applicant.
|
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: McDermott Will & Emery LLP
Description
FIG. 1 is a perspective view of a semiconductor device showing our
new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
* * * * *