Ha; Job
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ha; Job.The latest application filed is for "semiconductor package".
- Ha; Job - Suwon-si KR
- Ha; Job - Suwon KR
- Ha; Job - Gyunggi-do KR
| Patent | Date |
|---|---|
| Semiconductor package Grant 11,227,835 - Ha , et al. January 18, 2 | 2022-01-18 |
| Semiconductor package Grant 10,854,561 - Park , et al. December 1, 2 | 2020-12-01 |
| Hybrid interposer and semiconductor package including the same Grant 10,811,358 - Ha , et al. October 20, 2 | 2020-10-20 |
| Semiconductor Package App 20200235058 - Park; Mi Jin ; et al. | 2020-07-23 |
| Semiconductor Package App 20200203279 - Ha; Job ; et al. | 2020-06-25 |
| Hybrid Interposer And Semiconductor Package Including The Same App 20200168552 - HA; Job ; et al. | 2020-05-28 |
| Semiconductor package Grant 10,559,541 - Park , et al. Feb | 2020-02-11 |
| Semiconductor Package App 20190393168 - PARK; Mi Jin ; et al. | 2019-12-26 |
| All-in-one power semiconductor module Grant 9,455,207 - Kim , et al. September 27, 2 | 2016-09-27 |
| Package Substrate And Semiconductor Package Using The Same App 20150228567 - Ha; Job | 2015-08-13 |
| Power module package and method of manufacturing the same Grant 9,099,451 - Ha August 4, 2 | 2015-08-04 |
| Power Module Package And Method Of Manufacturing The Same App 20150144991 - Ha; Job | 2015-05-28 |
| Power Semiconductor Module And Method Of Manufacturing The Same App 20150145123 - Ha; Job | 2015-05-28 |
| Semiconductor device Grant D717,256 - Sohn , et al. November 11, 2 | 2014-11-11 |
| Semiconductor device Grant D717,254 - Jo , et al. November 11, 2 | 2014-11-11 |
| Semiconductor device Grant D717,253 - Jo , et al. November 11, 2 | 2014-11-11 |
| Power Semiconductor Module App 20140138839 - Ha; Job ; et al. | 2014-05-22 |
| All-in-one Power Semiconductor Module App 20140118956 - KIM; Kwang Soo ; et al. | 2014-05-01 |
| Semiconductor Package App 20140001613 - HA; Job | 2014-01-02 |
| Semiconductor Package Module App 20130285232 - Ha; Job | 2013-10-31 |
| Semiconductor Package App 20130147027 - Ha; Job | 2013-06-13 |
| Semiconductor Package App 20130134569 - Ha; Job | 2013-05-30 |
| Wafer level device package with sealing line having electroconductive pattern and method of packaging the same Grant 7,911,043 - Hong , et al. March 22, 2 | 2011-03-22 |
| Wafer level device package with sealing line having electroconductive pattern and method of packaging the same App 20080290479 - Hong; Ju Pyo ; et al. | 2008-11-27 |
| Wafer level package and wafer level packaging method App 20080283989 - Jeung; Won Kyu ; et al. | 2008-11-20 |
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