Power semiconductor module

Description

FIG. 1 is a perspective view of a power semiconductor module showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left-side view thereof;

FIG. 5 is a right-side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a power semiconductor module, as shown and described.

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Inventors:	Lim; Jae Hyun (Gyunggi-do, KR), Lee; Young Ki (Gyunggi-do, KR), Kim; Tae Hyun (Gyunggi-do, KR), Yang; Si Joong (Gyunggi-do, KR), Kim; Jong Man (Gyunggi-do, KR), Oh; Kyu Kwan (Gyunggi-do, KR), Sohn; Young Ho (Gyunggi-do, KR)
Applicant:	Name City State Country Type Samsung Electro-Mechanics Co., Ltd. Gyunggi-do N/A KR
Assignee:	Samsung Electro-Mechanics Co., Ltd. (Suwon, Gyeonggi-Do, KR)
Appl. No.:	D/450,498
Filed:	March 18, 2013

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Foreign Application Priority Data

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Dec 6, 2012 [KR]			30-2012-0058592

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/110,182 ;361/713,714,715,728,736,752,774,775,783,784,785,813 ;257/668,678,684,690

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References Cited [Referenced By]

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U.S. Patent Documents

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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: McDermott Will & Emery LLC