Yang; Si Joong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Si Joong.The latest application filed is for "image sensor package".

Company Profile

0.8.16

Yang; Si Joong - Suwon-si KR
Yang; Si Joong - Suwon KR
Yang; Si Joong - Gyunggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Image sensor package including reflector Grant 11,387,270 - Yoo , et al. July 12, 2	2022-07-12
Image Sensor Package App 20200395396 - YOO; Do Jae ; et al.	2020-12-17
Image Sensor Package App 20200350351 - YOO; Do Jae ; et al.	2020-11-05
All-in-one power semiconductor module Grant 9,455,207 - Kim , et al. September 27, 2	2016-09-27
Semiconductor module package Grant 9,123,688 - Kim , et al. September 1, 2	2015-09-01
Power Semiconductor Package App 20150091146 - Oh; Kyu Hwan ; et al.	2015-04-02
Semiconductor device Grant D719,926 - Sohn , et al. December 23, 2	2014-12-23
Semiconductor device Grant D719,113 - Sohn , et al. December 9, 2	2014-12-09
Semiconductor Module Package App 20140183717 - Kim; Tae Hyun ; et al.	2014-07-03
All-in-one Power Semiconductor Module App 20140118956 - KIM; Kwang Soo ; et al.	2014-05-01
Power semiconductor module Grant D703,625 - Lim , et al. April 29, 2	2014-04-29
Power Module Package App 20140110833 - Yoo; Do Jae ; et al.	2014-04-24
Semiconductor Package, Manufacturing Method Thereof, And Semiconductor Package Manufacturing Mold App 20140035157 - YANG; Si Joong ; et al.	2014-02-06
Power Package Module And Manufacturing Method Thereof App 20140029201 - YANG; Si Joong ; et al.	2014-01-30
Inertial Sensor App 20120125096 - Park; Heung Woo ; et al.	2012-05-24
Wafer-level image sensor module, method of manufacturing the same and camera module App 20110012220 - Park; Seung Wook ; et al.	2011-01-20
Wafer level package fabrication method Grant 7,696,004 - Yuan , et al. April 13, 2	2010-04-13
Method for manufacturing semiconductor package Grant 7,670,878 - Yuan , et al. March 2, 2	2010-03-02
Wafer-level package and method of manufacturing the same App 20090085204 - Park; Seung Wook ; et al.	2009-04-02
Wafer-level image sensor module, method of manufacturing the same, and camera module App 20090085134 - Park; Seung Wook ; et al.	2009-04-02
Wafer level package fabrication method App 20080299706 - Yuan; Jingli ; et al.	2008-12-04
Method for manufacturing semiconductor package App 20080286904 - Yuan; Jing Li ; et al.	2008-11-20
Semiconductor laser diode having a PCB type lead frame App 20050063434 - Park, Chan Wang ; et al.	2005-03-24

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