U.S. patent number D476,959 [Application Number D/164,710] was granted by the patent office on 2003-07-08 for semiconductor device. This patent grant is currently assigned to Mitsubishi Denki Kabushiki Kaisha. Invention is credited to Seiji Saiki, Junji Yamada.
United States Patent | D476,959 |
Yamada , et al. | July 8, 2003 |
Inventors: | Yamada; Junji (Tokyo, JP), Saiki; Seiji (Fukuoka, JP) |
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Assignee: | Mitsubishi Denki Kabushiki
Kaisha (Tokyo, JP) |
Appl. No.: | D/164,710 |
Filed: | July 31, 2002 |
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/110,123,125,179,182 ;174/16.3,52.1,52.2,52.4,261 ;211/4.17,162 ;361/718,728,747,748,760,774,784,785,813,820 |
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D389808 | January 1998 | Yamada et al. |
D396450 | July 1998 | Nishiura et al. |
D396847 | August 1998 | Nakayama et al. |
5991162 | November 1999 | Saso |
D453746 | February 2002 | Kato et al. |
6355877 | March 2002 | Watanabe |
J Yamada, et al., "Next Generation High Power Dual IGBT Module with CSTBT Chip and New Packgage Concept", Official Proceedings International Conferences ZM Communications GmbH, PCIM 2002, Power Electronics, May 14-16, 2002, 11 pages.. |
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