Semiconductor device

Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof; and,

FIG. 8 is an enlarged cross-sectional view thereof and, taken along line 8--8 of FIG. 2, with the internal system omitted.

Claims

The ornamental design for a semiconductor device, as shown and described.

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Inventors:	Kawafuji; Hisashi (Fukuoka, JP), Takeshita; Tatsuyuki (Fukuoka, JP)
Assignee:	Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP)
Appl. No.:	D/213,816
Filed:	September 24, 2004

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Foreign Application Priority Data

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Mar 26, 2004 [JP]			2004-009136

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;174/52.1,52.2,52.4 ;257/666,669,675,676,678,690,692,696,697,730,787 ;361/773,820 ;438/64,65

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References Cited [Referenced By]

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U.S. Patent Documents

D394244	May 1998	Majumdar et al.
D401912	December 1998	Majumdar et al.
D418185	December 1999	McCormick et al.
D448739	October 2001	Iwasaki et al.
D448740	October 2001	Iwasaki et al.
D472530	April 2003	Iwasaki et al.

Foreign Patent Documents

	098 288 601		Jun 1997		JP
	106 57 0100		Apr 2000		JP

Primary Examiner: Reid; Stella
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Sughrue Mion, PLLC