Semiconductor module

Takahashi , et al. May 20, 2

Patent Grant D705184

U.S. patent number D705,184 [Application Number D/467,820] was granted by the patent office on 2014-05-20 for semiconductor module. This patent grant is currently assigned to Fuji Electric Co., Ltd.. The grantee listed for this patent is Fuji Electric Co., Ltd.. Invention is credited to Satoru Motohashi, Hideaki Takahashi, Masahiro Taoka, Kenshi Terashima.


United States Patent D705,184
Takahashi ,   et al. May 20, 2014

Semiconductor module

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.
Inventors: Takahashi; Hideaki (Matsumoto, JP), Terashima; Kenshi (Matsumoto, JP), Motohashi; Satoru (Matsumoto, JP), Taoka; Masahiro (Matsumoto, JP)
Applicant:
Name City State Country Type

Fuji Electric Co., Ltd.

Kawasaki

N/A

JP
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa, JP)
Appl. No.: D/467,820
Filed: September 24, 2013

Foreign Application Priority Data

Jul 11, 2013 [JP] D2013-015885
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/110,182,184 ;174/250,253 ;257/666,668,678,690,694,696 ;361/713,728,736,775

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Other References

"General Catalog of Fuji Semiconductors," Cover page, index, p. 75 and notices (5 pages total), Fuji Electric Co., Ltd., JP (Dec. 2012). cited by applicant .
U.S. Appl. No. 29/458,663, filed Jun. 21, 2013. cited by applicant .
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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Young Basile Hanlon & MacFarlane P.C.

Description



FIG. 1 is a front view of a semiconductor module according to our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1; and,

FIG. 7 is a top, front, right side perspective view of the semiconductor module of FIG. 1.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted.

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