U.S. patent number D705,184 [Application Number D/467,820] was granted by the patent office on 2014-05-20 for semiconductor module. This patent grant is currently assigned to Fuji Electric Co., Ltd.. The grantee listed for this patent is Fuji Electric Co., Ltd.. Invention is credited to Satoru Motohashi, Hideaki Takahashi, Masahiro Taoka, Kenshi Terashima.
United States Patent | D705,184 |
Takahashi , et al. | May 20, 2014 |
Inventors: | Takahashi; Hideaki (Matsumoto, JP), Terashima; Kenshi (Matsumoto, JP), Motohashi; Satoru (Matsumoto, JP), Taoka; Masahiro (Matsumoto, JP) | ||||||||||
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Applicant: |
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Assignee: | Fuji Electric Co., Ltd.
(Kawasaki-shi, Kanagawa, JP) |
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Appl. No.: | D/467,820 | ||||||||||
Filed: | September 24, 2013 |
Jul 11, 2013 [JP] | D2013-015885 | |||
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/110,182,184 ;174/250,253 ;257/666,668,678,690,694,696 ;361/713,728,736,775 |
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"General Catalog of Fuji Semiconductors," Cover page, index, p. 75 and notices (5 pages total), Fuji Electric Co., Ltd., JP (Dec. 2012). cited by applicant . U.S. Appl. No. 29/458,663, filed Jun. 21, 2013. cited by applicant . U.S. Appl. No. 29/458,665, filed Jun. 21, 2013. cited by applicant . U.S. Appl. No. 29/458,667, filed Jun. 21, 2013. cited by applicant . U.S. Appl. No. 29/458,669, filed Jun. 21, 2013. cited by applicant . U.S. Appl. No. 29/460,862, filed Jul. 16, 2013. cited by applicant . U.S. Appl. No. 29/460,861, filed Jul. 16, 2013. cited by applicant . U.S. Appl. No. 29/460,860, filed Jul. 16, 2013. cited by applicant . U.S. Appl. No. 29/460,859, filed Jul. 16, 2013. cited by applicant . U.S. Appl. No. 29/460,858, filed Jul. 16, 2013. cited by applicant. |
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