Power semiconductor module
Bertalan , et al. February 2, 2
U.S. patent number D748,595 [Application Number D/516,506] was granted by the patent office on 2016-02-02 for power semiconductor module. This patent grant is currently assigned to Infineon Technologies AG. The grantee listed for this patent is Infineon Technologies AG. Invention is credited to Andras Bertalan, Georg Borghoff, Alexander Hoehn.
| United States Patent | D748,595 |
| Bertalan , et al. | February 2, 2016 |
Power semiconductor module
Claims
CLAIM The ornamental design for a power semiconductor module, as shown and described.
| Inventors: | Bertalan; Andras (Warstein-Allagen, DE), Borghoff; Georg (Warstein, DE), Hoehn; Alexander (Soest, DE) | ||||||||||
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| Applicant: |
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| Assignee: | Infineon Technologies AG
(Neubiberg, DE) |
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| Appl. No.: | D/516,506 | ||||||||||
| Filed: | February 3, 2015 |
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/110,182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106 |
References Cited [Referenced By]
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Attorney, Agent or Firm: Murphy, Bilak & Homiller, PLLC
Description
FIG. 1 is a top, side, perspective view of a power semiconductor module showing our new design;
FIG. 2 is another top, side, perspective view thereof;
FIG. 3 is a side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is another side elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is another side elevational view thereof.
All surfaces not shown form no part of the claimed design.
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