Semiconductor module

Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1; and,

FIG. 7 is a top, front and right side perspective view of the semiconductor module of FIG. 1.

The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals projects from the top surface. Each end in a longitudinal direction includes a mounting hole. Each corner includes a positioning boss.

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.

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Inventors:	Motohashi; Satoru (Nagano, JP), Takahashi; Hideaki (Nagano, JP), Karasawa; Tatsuya (Nagano, JP), Terashima; Kenshi (Nagano, JP)
Applicant:	Name City State Country Type Fuji Electric Co., Ltd. Kawasaki-shi, Kanagawa N/A JP
Assignee:	Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa, JP)
Appl. No.:	D/491,549
Filed:	May 22, 2014

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Foreign Application Priority Data

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Feb 19, 2014 [JP]			D2014-003350

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/110,182 ;257/678,684,690,691 ;361/713,679.01,728,736,772,773,774,775,760,761,783,820 ;174/250,253 ;438/15,25,26,51,54,55,63,64,65,106

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References Cited [Referenced By]

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U.S. Patent Documents

D318646	July 1991	Karbassi
5031462	July 1991	Lam
5184107	February 1993	Maurer
D390833	February 1998	Takizawa et al.
D395423	June 1998	Koyama et al.
D396696	August 1998	Takagi et al.
D432095	October 2000	Seeger et al.
D436085	January 2001	Takizawa et al.
D441726	May 2001	Sofue et al.
D472529	April 2003	Okuyama et al.
D472531	April 2003	Okuyama et al.
D485242	January 2004	Iwafuchi et al.
D493152	July 2004	Baker et al.
D505923	June 2005	Okuyama et al.
D505924	June 2005	Okuyama et al.
D554084	October 2007	Iizuka
D576577	September 2008	Kobayashi et al.
D587662	March 2009	Soutome et al.
D589012	March 2009	Soyano et al.
D597504	August 2009	Kobayashi et al.
D606951	December 2009	Soyano et al.
D653633	February 2012	Soyano
D653634	February 2012	Soyano
D689833	September 2013	Hori et al.
D693318	November 2013	Shinkai
D699693	February 2014	Otsuka et al.
D703625	April 2014	Lim et al.
D704670	May 2014	Chen et al.
D704671	May 2014	Chen et al.
D705184	May 2014	Takahashi et al.
D710318	August 2014	Chen et al.

Foreign Patent Documents

	002305607-0001		Sep 2013		EM

Other References

US. Appl. No. 29/458,663, filed Jun. 21, 2013. cited by applicant . U.S. Appl. No. 29/458,665, filed Jun. 21, 2013. cited by applicant . U.S. Appl. No. 29/458,667, filed Jun. 21, 2013. cited by applicant . U.S. Appl. No. 29/458,669, filed Jun. 21, 2013. cited by applicant . U.S. Appl. No. 29/460,862, filed Jul. 16, 2013. cited by applicant . U.S. Appl. No. 29/460,861, filed Jul. 16, 2013. cited by applicant . U.S. Appl. No. 29/460,859, filed Jul. 16, 2013. cited by applicant.

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Young Basile Hanlon & MacFarlane P.C.