Semiconductor package

Description

FIG. 1 is a perspective view of a first embodiment of a semiconductor package showing our new design;

FIG. 2 is a left side elevational view thereof, top plan, bottom plan and right side elevational views are the same image;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a perspective view of a second embodiment of a semiconductor package showing our new design;

FIG. 6 is a top plan view of the embodiment of FIG. 5;

FIG. 7 is a left side elevational view of the embodiment of FIG. 5;

FIG. 8 is a front elevational view of the embodiment of FIG. 5;

FIG. 9 is a bottom plan view of the embodiment of FIG. 5;

FIG. 10 is a right side elevational view of the embodiment of FIG. 5;

FIG. 11 is a rear elevational view of the embodiment of FIG. 5;

FIG. 12 is a perspective view of a third embodiment of a semiconductor package showing our new design;

FIG. 13 is a top plan view of the embodiment of FIG. 12;

FIG. 14 is a left side elevational view of the embodiment of FIG. 12;

FIG. 15 is a front elevational view of the embodiment of FIG. 12;

FIG. 16 is a bottom plan view of the embodiment of FIG. 12;

FIG. 17 is a right side elevational view of the embodiment of FIG. 12; and,

FIG. 18 is a rear elevational view of the embodiment of FIG. 12.

Claims

The ornamental design for a semiconductor package, as shown and described.

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Inventors:	Koyama; Michio (Tokyo, JP), Wataya; Yukinobu (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/068,117
Filed:	March 13, 1997

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Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;174/52.2-52.4 ;206/710,719 ;257/254,659,666,678-697,730,738,780 ;437/183,217,220

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References Cited [Referenced By]

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U.S. Patent Documents

4681221	July 1987	Chickanosky
5394009	February 1995	Loo
5403776	April 1995	Tsuji et al.
5557142	September 1996	Gilmore et al.
5614742	March 1997	Gessner et al.

Primary Examiner: Gandy; James
Assistant Examiner: Matta; Cathron B.
Attorney, Agent or Firm: Foley & Lardner