Karasawa; Tatsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Karasawa; Tatsuya.The latest application filed is for "semiconductor device and semiconductor device manufacturing method".

Company Profile

0.6.5

Karasawa; Tatsuya - Shiojiri JP
KARASAWA; Tatsuya - Shiojiri-city JP
Karasawa; Tatsuya - Nagano JP
Karasawa; Tatsuya - Shiojiri-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having case to which circuit board is bonded by bonding material and method of manafacturing thereof Grant 11,177,236 - Karasawa November 16, 2	2021-11-16
Semiconductor Device And Semiconductor Device Manufacturing Method App 20200126947 - KARASAWA; Tatsuya	2020-04-23
Semiconductor module having supporting portion for fastening portion inside a through hole in a resin case Grant 10,381,243 - Karasawa A	2019-08-13
Semiconductor Module And Method Of Manufacturing Semiconductor Module App 20180076053 - KARASAWA; Tatsuya	2018-03-15
Power semiconductor module device Grant 9,832,903 - Karasawa November 28, 2	2017-11-28
Power Semiconductor Module Device App 20160095244 - KARASAWA; Tatsuya	2016-03-31
Semiconductor device and semiconductor device manufacturing method Grant 8,994,164 - Takahashi , et al. March 31, 2	2015-03-31
Semiconductor module Grant D724,554 - Motohashi , et al. March 17, 2	2015-03-17
Semiconductor Device And Semiconductor Device Manufacturing Method App 20140246769 - Takahashi; Hideaki ; et al.	2014-09-04

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