Semiconductor element

Description

FIG. 1 is a perspective view of a first embodiment of a semiconductor element showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof; and

FIG. 6 is a top plan view thereof.

FIG. 7 is a perspective view of a second embodiment of a semiconductor element showing our new design;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a left side elevational view thereof;

FIG. 11 is a right side elevational view thereof; and

FIG. 12 is a top plan view thereof.

FIG. 13 is a perspective view of a third embodiment of a semiconductor element showing our new design;

FIG. 14 is a front elevational view thereof;

FIG. 15 is a rear elevational view thereof;

FIG. 16 is a left side elevational view thereof;

FIG. 17 is a right side elevational view thereof; and

FIG. 18 is a top plan view thereof.

FIG. 19 is a perspective view of a fourth embodiment of a semiconductor element showing our new design;

FIG. 20 is a front elevational view thereof;

FIG. 21 is a rear elevational view thereof;

FIG. 22 is a left side elevational view thereof;

FIG. 23 is a right side elevational view thereof; and

FIG. 24 is a top plan view thereof.

Lower part of the semiconductor element is opaque or transparent.

FIG. 25 is a perspective view of a fifth embodiment of a semiconductor element showing our new design;

FIG. 26 is a front elevational view thereof;

FIG. 27 is a rear elevational view thereof;

FIG. 28 is a left side elevational view thereof;

FIG. 29 is a right side elevational view thereof; and

FIG. 30 is a top plan view thereof.

Lower part of the semiconductor element is opaque or transparent.

FIG. 31 is a perspective view of a sixth embodiment of a semiconductor element showing our new design;

FIG. 32 is a front elevational view thereof;

FIG. 33 is a rear elevational view thereof;

FIG. 34 is a left side elevational view thereof;

FIG. 35 is a right side elevational view thereof; and,

FIG. 36 is a top plan view thereof.

Lower part of the semiconductor element is opaque or transparent.

The broken lines shown in the Figures are for illustrative purposes only and form no part of the claimed design. A bottom plan view in the first, second, third, fourth, fifth, and sixth embodiments is not part of the claimed design.

Claims

The ornamental design for a semiconductor element, as shown and described.

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Inventors:	Okuyama; Hiroyuki (Tokyo, JP), Doi; Masato (Tokyo, JP), Biwa; Goshi (Tokyo, JP), Oohata; Toyoharu (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/193,675
Filed:	November 13, 2003

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Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D3/5 ;D21/834 ;216/2,11 ;257/77,94,95,190 ;313/309,311 ;369/126 ;438/20,116 ;455/50

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References Cited [Referenced By]

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U.S. Patent Documents

4685996	August 1987	Busta et al.
5536193	July 1996	Kumar
5580827	December 1996	Akamine
5923637	July 1999	Shimada et al.
5962958	October 1999	Nakamoto
6156215	December 2000	Shimada et al.
6229160	May 2001	Krames et al.
6323063	November 2001	Krames et al.
6337477	January 2002	Shimada et al.
D472529	April 2003	Okuyama et al.
D472531	April 2003	Okuyama et al.
D485242	January 2004	Iwafuchi et al.
6762543	July 2004	Kang et al.

Foreign Patent Documents

	2002-100805		Apr 2002		JP

Primary Examiner: Reid; Stella
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC