U.S. patent number D693,318 [Application Number D/416,998] was granted by the patent office on 2013-11-12 for semiconductor module for power conversion.
This patent grant is currently assigned to Sumitomo Electric Industries, Ltd.. The grantee listed for this patent is Jiro Shinkai. Invention is credited to Jiro Shinkai.
United States Patent |
D693,318 |
Shinkai |
November 12, 2013 |
Semiconductor module for power conversion
Claims
CLAIM The ornamental design for a semiconductor module for power
conversion, as shown and described.
Inventors: |
Shinkai; Jiro (Osaka,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Shinkai; Jiro |
Osaka |
N/A |
JP |
|
|
Assignee: |
Sumitomo Electric Industries,
Ltd. (Osaka-shi, JP)
|
Appl.
No.: |
D/416,998 |
Filed: |
March 29, 2012 |
Foreign Application Priority Data
|
|
|
|
|
Oct 27, 2011 [JP] |
|
|
D2011-024803 |
Oct 27, 2011 [JP] |
|
|
D2011-024804 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/110,182
;361/748,760,783,787,813,774,784,785,713,728,736,752
;257/787,668,678,690 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Other References
Notice of Allowance in Taiwan Design Patent Application No.
101301952 dated Jan. 23, 2013. cited by applicant.
|
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Venable LLP Sartori; Michael A.
Aga; Tamatane J.
Description
FIG. 1 is a front view of a first embodiment of a semiconductor
module for power conversion showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a front, right, top perspective view thereof;
FIG. 8 is a cross sectional view of the semiconductor module for
power conversion of FIG. 1 taken along lines 8-8 of FIG. 1;
FIG. 9 is a front, right, top perspective view of the semiconductor
module for power conversion of FIG. 1 shown in a used
condition;
FIG. 10 a front view of a second embodiment of a semiconductor
module for power conversion showing my new design;
FIG. 11 is a rear view thereof;
FIG. 12 is a top view thereof;
FIG. 13 is a bottom view thereof;
FIG. 14 is a right side view thereof;
FIG. 15 is a left side view thereof;
FIG. 16 is a front, right, top perspective view thereof;
FIG. 17 is a cross sectional view of the semiconductor module for
power conversion of FIG. 1 taken along lines 17-17 of FIG. 10;
and,
FIG. 18 is a front, right, top perspective view of the
semiconductor module for power conversion of FIG. 10 shown in a
used condition.
The broken lines shown in the drawings represent portions of the
semiconductor module for power conversion that form no part of the
claimed design.
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