Semiconductor module

Nakamura January 20, 2

Patent Grant D721340

U.S. patent number D721,340 [Application Number D/458,667] was granted by the patent office on 2015-01-20 for semiconductor module. This patent grant is currently assigned to Fuji Electric Co., Ltd.. The grantee listed for this patent is Fuji Electric Co., Ltd.. Invention is credited to Hideyo Nakamura.


United States Patent D721,340
Nakamura January 20, 2015

Semiconductor module

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.
Inventors: Nakamura; Hideyo (Kawasaki, JP)
Applicant:
Name City State Country Type

Fuji Electric Co., Ltd.

Kawasaki

N/A

JP
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa, JP)
Appl. No.: D/458,667
Filed: June 21, 2013

Foreign Application Priority Data

Dec 21, 2012 [JP] D2012-031249
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/110,182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106

References Cited [Referenced By]

U.S. Patent Documents
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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Young Basile Hanlon & MacFarlane P.C.

Description



FIG. 1 is a front view of a semiconductor module showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a cross-sectional view thereof taken along line 8-8 of FIG. 5.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals protrudes from the top surface. Each end in a longitudinal direction includes a mounting hole.

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