Semiconductor module

Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1; and,

FIG. 7 is a top, front, right side perspective view of the semiconductor module of FIG. 1.

The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design.

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.

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Inventors:	Sawayanagi; Satoshi (Matsumoto, JP), Taoka; Masahiro (Matsumoto, JP), Oose; Tomofumi (Matsumoto, JP), Takahashi; Hideaki (Omachi, JP)
Applicant:	Name City State Country Type FUJI ELECTRIC CO., LTD. Kawasaki N/A JP
Assignee:	FUJI ELECTRIC CO., LTD. (Kawasaki, JP)
Appl. No.:	D/598,481
Filed:	March 27, 2017

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Foreign Application Priority Data

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Nov 8, 2016 [JP]			2016-024300

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64

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References Cited [Referenced By]

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U.S. Patent Documents

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Primary Examiner: Oswecki; Elizabeth J