Power semiconductor module
Muehlensiep , et al. July 26, 2
U.S. patent number D762,185 [Application Number D/518,151] was granted by the patent office on 2016-07-26 for power semiconductor module. This patent grant is currently assigned to Infineon Technologies AG. The grantee listed for this patent is Infineon Technologies AG. Invention is credited to Jutta Muehlensiep, Michael Sielaff.
| United States Patent | D762,185 |
| Muehlensiep , et al. | July 26, 2016 |
Power semiconductor module
Claims
CLAIM The ornamental design for a power semiconductor module, as shown and described.
| Inventors: | Muehlensiep; Jutta (Wermelskirchen, DE), Sielaff; Michael (Erwitte, DE) | ||||||||||
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| Applicant: |
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| Assignee: | Infineon Technologies AG
(Neubiberg, DE) |
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| Appl. No.: | D/518,151 | ||||||||||
| Filed: | February 20, 2015 |
Foreign Application Priority Data
| Aug 21, 2014 [EM] | 002522987-0002 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/110,182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106 |
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Attorney, Agent or Firm: Murphy, Bilak & Homiller, PLLC
Description
FIG. 1 is a top, side perspective view of a power semiconductor module, showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is rear elevation view thereof; and,
FIG. 5 is a side elevation view thereof.
All surfaces not shown form no part of the claimed design.
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