Semiconductor housing

Description

FIG. 1 is a right side, top and front perspective view of a semiconductor housing showing my new design;

FIG. 2 is a top plan view thereof on a reduced scale;

FIG. 3 is a bottom plan view thereof on a reduced scale;

FIG. 4 is a left side elevational view thereof on a reduced scale;

FIG. 5 is a right side elevational view thereof on a reduced scale;

FIG. 6 is a front elevational view thereof on a reduced scale;

FIG. 7 is a rear elevational view thereof on a reduced scale;

FIG. 8 is a top plan view of second embodiment of my new design, the second embodiment being identical to the first except for the number of leads on the right hand side;

FIG. 9 is a bottom plan view thereof;

FIG. 10 is a top plan view of a third embodiment of my new design, the third design being identical to the first embodiment except for the shape of the two leads on the left hand side;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a right side, top and front perspective view of a fourth embodiment of my new design;

FIG. 13 is a top plan view thereof on a reduced scale;

FIG. 14 is a front elevational view thereof on a reduced scale;

FIG. 15 is a left side elevational view thereof on a reduced scale;

FIG. 16 is a right side, top and front perspective view of a fifth embodiment of my new design, the fifth embodiment being identical to the first embodiment except for the flat top surface;

FIG. 17 is a right side, top and front perspective view of a sixth embodiment of my new design;

FIG. 18 is a top plan view thereof on a reduced scale;

FIG. 19 is a bottom plan view thereof on a reduced scale;

FIG. 20 is a left side elevational view thereof on a reduced scale;

FIG. 21 is a right side elevational view thereof on a reduced scale.

Claims

The ornamental design for a semiconductor housing, as shown and described.

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Inventors:	Du Bois; Jerry M. (Mesa, AZ)
Assignee:	Motorola, Inc. (Schaumburg, IL)
Appl. No.:	06/649,081
Filed:	September 10, 1984

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Current U.S. Class:	D13/182
Field of Search:	;D13/40,41,99 ;361/394,395,399,400,331 ;174/52R,52PE,52S ;357/70,72,74

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References Cited [Referenced By]

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U.S. Patent Documents

3340347	September 1967	Spiegler
3902148	August 1975	Drees et al.
3918084	November 1975	Schierz
3946428	March 1976	Anazawa et al.
4047197	September 1977	Schierz
4067040	January 1978	Tsuzuki et al.
4079410	March 1978	Schierz
4106052	August 1978	Schierz
4213141	May 1978	Colussi
4218724	August 1980	Kaufman
4278990	July 1981	Fichot
4278991	July 1981	Ritchie et al.
4340900	July 1982	Goronkin

Foreign Patent Documents

	2607083		Sep 1977		DE

Other References

IBM Technical Disclosure Bulletin, vol. 21, #1, 6-1978, pp. 99-100, Circuit Chip Support Assembly, Coombs & Larnerd..

Primary Examiner: Lucas; Susan J.
Attorney, Agent or Firm: Handy; Robert