Semiconductor device

Kawase December 19, 2

Patent Grant D805485

U.S. patent number D805,485 [Application Number D/591,886] was granted by the patent office on 2017-12-19 for semiconductor device. This patent grant is currently assigned to Mitsubishi Electric Corporation. The grantee listed for this patent is Mitsubishi Electric Corporation. Invention is credited to Tatsuya Kawase.


United States Patent D805,485
Kawase December 19, 2017

Semiconductor device

Claims

CLAIM The ornamental design for a semiconductor device, as shown and described.
Inventors: Kawase; Tatsuya (Chiyoda-ku, JP)
Applicant:
Name City State Country Type

Mitsubishi Electric Corporation

Chiyoda-ku, Tokyo

N/A

JP
Assignee: Mitsubishi Electric Corporation (Tokyo, JP)
Appl. No.: D/591,886
Filed: January 25, 2017

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29555470 Feb 22, 2016 D785577
29472087 Apr 19, 2016 D754084

Foreign Application Priority Data

Aug 21, 2013 [JP] 2013-019030
Aug 21, 2013 [JP] 2013-019056
Aug 21, 2013 [JP] 2013-019057
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/110,182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106

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Foreign Patent Documents
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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Sughrue Mion, PLLC Turner; Richard C.

Description



FIG. 1 is a top, left and rear side perspective view of a semiconductor device, showing my new design;

FIG. 2 is bottom, right and rear side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is another top, left and rear side perspective view thereof, shown in a used condition mounted on a board shown in broken lines; and,

FIG. 10 is another rear view thereof, shown in a used condition mounted on a board shown in broken lines.

The broken lines shown in the drawing views in FIGS. 9 and 10 form no part of the claimed design.

* * * * *


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