U.S. patent number D775,593 [Application Number D/517,908] was granted by the patent office on 2017-01-03 for power semiconductor module.
This patent grant is currently assigned to Infineon Technologies AG. The grantee listed for this patent is Infineon Technologies AG. Invention is credited to Stefan Edenharter, Christoph Koch, Sven Schennetten.
United States Patent |
D775,593 |
Edenharter , et al. |
January 3, 2017 |
Power semiconductor module
Claims
CLAIM The ornamental design for a power semiconductor module, as
shown and described.
Inventors: |
Edenharter; Stefan
(Unterhaching, DE), Koch; Christoph (Salzkotten,
DE), Schennetten; Sven (Balve, DE) |
Applicant: |
Name |
City |
State |
Country |
Type |
Infineon Technologies AG |
Neubiberg |
N/A |
DE |
|
|
Assignee: |
Infineon Technologies AG
(Neubiberg, DE)
|
Appl.
No.: |
D/517,908 |
Filed: |
February 18, 2015 |
Foreign Application Priority Data
|
|
|
|
|
Aug 19, 2014 [EM] |
|
|
002521518-0001 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/110,182
;257/678,684,690,691
;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253
;438/15,25,26,51,55,63,64,106 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Murphy, Bilak & Homiller,
PLLC
Description
FIG. 1 is a bottom plan view of a power semiconductor module
showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a side elevational view thereof;
FIG. 4 is another side elevational view thereof; and,
FIG. 5 is a top, side perspective view thereof.
All surfaces not shown form no part of the claimed design.
* * * * *