U.S. patent number D879,729 [Application Number D/609,504] was granted by the patent office on 2020-03-31 for electrical module. This patent grant is currently assigned to Meike Technology (Beijing) Ltd., Microduino Inc.. The grantee listed for this patent is Meike Technology (Beijing) Ltd., Microduino Inc.. Invention is credited to Bin Feng, Jian Hu, Xi Li, Kejia Pan, Zhenshan Wang.
United States Patent | D879,729 |
Wang , et al. | March 31, 2020 |
Inventors: | Wang; Zhenshan (Westlake Village, CA), Hu; Jian (Westlake Village, CA), Pan; Kejia (Westlake Village, CA), Li; Xi (Westlake Village, CA), Feng; Bin (Westlake Village, CA) | ||||||||||
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Applicant: |
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Assignee: | Microduino Inc. (Westlake
Village, CA) Meike Technology (Beijing) Ltd. (Beijing, CN) |
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Appl. No.: | D/609,504 | ||||||||||
Filed: | June 30, 2017 |
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106 |
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