Semiconductor module

Description

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a front, right, and bottom perspective view thereof;

FIG. 8 is a rear, left and top perspective view thereof; and,

FIG. 9 is a cross sectional view taken along line 9-9 of FIG. 1.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. Plate shaped terminals are provided on the left side and right side. A plurality of post shaped pins extend from a rear surface. The cross-sections of the post shaped pins are rhombic. A hole penetrates from a front surface to the rear surface at each of four corners of the semiconductor module.

Claims

CLAIM The ornamental design for a semiconductor module, as shown and described.

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Inventors:	Soyano; Shin (Tokyo, JP), Takamiya; Yoshikazu (Tokyo, JP), Yamada; Toru (Tokyo, JP), Maruyama; Ryo (Tokyo, JP)
Applicant:	Name City State Country Type Fuji Electric Co., Ltd Kawasaki-shi, Kanagawa N/A JP
Assignee:	Fuji Electric Co., Ltd (Kawasaki-shi, JP)
Appl. No.:	D/580,738
Filed:	October 12, 2016

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	29531129	Jun 23, 2015	D772184

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Foreign Application Priority Data

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Dec 24, 2014 [JP]			D2014-028804
Dec 24, 2014 [JP]			D2014-028805
Dec 24, 2014 [JP]			D2014-028806

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;257/678,684,690,691 ;361/679.01,713,728,736,760,761,772,775,783,820 ;174/250,253 ;438/15,25,26,51,55,63,64,106

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References Cited [Referenced By]

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U.S. Patent Documents

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Other References

US. Appl. No. 29/580,736, filed Oct. 12, 2016. cited by applicant.

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Young Basile Hanlon & MacFarlane, P.C.