U.S. patent number D942,516 [Application Number D/679,734] was granted by the patent office on 2022-02-01 for process shield for a substrate processing chamber.
This patent grant is currently assigned to APPLIED MATERIALS, INC.. The grantee listed for this patent is APPLIED MATERIALS, INC.. Invention is credited to Aravind Kamath, Manjunatha P. Koppa, David Or, Steven V. Sansoni, Cheng-Hsiung Matt Tsai, Manjunath H. Venkataswamappa.
United States Patent |
D942,516 |
Koppa , et al. |
February 1, 2022 |
Process shield for a substrate processing chamber
Claims
CLAIM The ornamental design for a process shield for a substrate
processing chamber, as shown and described.
Inventors: |
Koppa; Manjunatha P.
(Bengaluru, IN), Kamath; Aravind (Santa Clara,
CA), Tsai; Cheng-Hsiung Matt (Cupertino, CA),
Venkataswamappa; Manjunath H. (Bangalore, IN),
Sansoni; Steven V. (Livermore, CA), Or; David (Santa
Clara, CA) |
Applicant: |
Name |
City |
State |
Country |
Type |
APPLIED MATERIALS, INC. |
Santa Clara |
CA |
US |
|
|
Assignee: |
APPLIED MATERIALS, INC. (Santa
Clara, CA)
|
Appl.
No.: |
D/679,734 |
Filed: |
February 8, 2019 |
Current U.S.
Class: |
D15/138;
D13/182 |
Current International
Class: |
1509 |
Field of
Search: |
;D23/249,259,262,269
;D15/138,139,143,144,144.1,144.2,150,199
;D13/118,122,133,162,182,184,199 ;D22/113,119 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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D1481081 |
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Oct 2013 |
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JP |
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D1509910 |
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Oct 2014 |
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D1549498 |
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May 2016 |
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D1570910 |
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Mar 2017 |
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D1575876 |
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May 2017 |
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D1584875 |
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Aug 2017 |
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D1584906 |
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Aug 2017 |
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D161030 |
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Jun 2014 |
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D166552 |
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Mar 2015 |
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TW |
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D167109 |
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Apr 2015 |
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TW |
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D166431 |
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D187432 |
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Dec 2017 |
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TW |
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Other References
Search Report for Taiwan Design Application No. 108304729, dated
Aug. 5, 2020. cited by applicant .
Search Report for Taiwan Design Application No. 108304735001, dated
Dec. 2, 2020. cited by applicant.
|
Primary Examiner: Lane; Sheryl
Assistant Examiner: Philipps; Mark T.
Attorney, Agent or Firm: Moser Taboada
Description
FIG. 1 is a top isometric view of a process shield for a substrate
processing chamber, according to one embodiment of the novel
design.
FIG. 2 is a bottom isometric view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a top plan view thereof.
FIG. 5 is a front elevation view thereof.
FIG. 6 is a back elevation view thereof.
FIG. 7 is a left side elevation view thereof.
FIG. 8 is a right side elevation view thereof.
FIG. 9 is cross-sectional view taken along line 9-9 of FIG. 3.
FIG. 10 is a top isometric view of a process shield for a substrate
processing chamber, according to another embodiment of the novel
design.
FIG. 11 is a bottom isometric view thereof.
FIG. 12 is a bottom plan view thereof.
FIG. 13 is a top plan view thereof.
FIG. 14 is a front elevation view thereof.
FIG. 15 is a back elevation view thereof.
FIG. 16 is a left side elevation view thereof.
FIG. 17 is a right side elevation view thereof.
FIG. 18 is cross-sectional view taken along line 18-18 of FIG. 12;
and,
FIG. 19 is cross-sectional view taken along line 19-19 of FIG.
14.
The dashed lines in FIGS. 1-19 represent unclaimed environment
forming no part of the claimed design.
* * * * *