Elastic membrane for semiconductor wafer polishing apparatus

Description

FIG. 1 is a top plan view of a first embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a cross sectional view taken along section line 6-6 in FIG. 1;

FIG. 7 is an enlarged perspective view of a portion labeled FIG. 7 in FIG. 1;

FIG. 8 is an opposite side view of FIG. 7;

FIG. 9 is a top plan view of a second embodiment of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 10 is a bottom plan view thereof;

FIG. 11 is a front side view thereof;

FIG. 12 is a right side view thereof;

FIG. 13 is a left side view thereof;

FIG. 14 is a cross sectional view taken along section line 14-14 in FIG. 9;

FIG. 15 is an enlarged perspective view of a portion labeled FIG. 15 in FIG. 9; and,

FIG. 16 is an opposite side view of FIG. 15.

The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design. The dashed-dot-dashed lines represent the boundary lines of the claimed design.

All surfaces not shown form no part of the claimed design.

Claims

CLAIM The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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Inventors:	Fukushima; Makoto (Tokyo, JP), Yasuda; Hozumi (Tokyo, JP), Namiki; Keisuke (Tokyo, JP), Nabeya; Osamu (Tokyo, JP), Togashi; Shingo (Tokyo, JP), Yamaki; Satoru (Tokyo, JP)
Applicant:	Name City State Country Type EBARA CORPORATION Tokyo N/A JP
Assignee:	EBARA CORPORATION (Tokyo, JP)
Appl. No.:	D/580,339
Filed:	October 7, 2016

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	29472346	Nov 12, 2013	D769200

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Foreign Application Priority Data

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May 15, 2013 [JP]			2013-10672
May 15, 2013 [JP]			2013-10673
May 15, 2013 [JP]			2013-10674
May 15, 2013 [JP]			2013-10675
May 15, 2013 [JP]			2013-10676
May 15, 2013 [JP]			2013-10677
May 15, 2013 [JP]			2013-10678

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;451/66,288,289

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References Cited [Referenced By]

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Foreign Patent Documents

	301348233		Sep 2010		CN
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	D 138225		Dec 2010		TW
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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Pearne & Gordon LLP