U.S. patent application number 15/810800 was filed with the patent office on 2018-09-13 for flexible electronic assembly method.
The applicant listed for this patent is Intel Corporation. Invention is credited to Kemal Aygun, Feras Eid, Adel A. Elsherbini, Charles Gealer, John S. Guzek, Telesphor Kamgaing, Omkar Karhade, Shawna Liff, Ravindranath V. Mahajan, James C. Matayabas, JR., Timothy McIntosh, Sasha N. Oster, Robert L. Sankman, Johanna M. Swan.
Application Number | 20180263117 15/810800 |
Document ID | / |
Family ID | 53185403 |
Filed Date | 2018-09-13 |
United States Patent
Application |
20180263117 |
Kind Code |
A1 |
Oster; Sasha N. ; et
al. |
September 13, 2018 |
FLEXIBLE ELECTRONIC ASSEMBLY METHOD
Abstract
This disclosure relates generally to devices, systems, and
methods for making a flexible microelectronic assembly. In an
example, a polymer is molded over a microelectronic component, the
polymer mold assuming a substantially rigid state following the
molding. A routing layer is formed with respect to the
microelectronic component and the polymer mold, the routing layer
including traces electrically coupled to the microelectronic
component. An input is applied to the polymer mold, the polymer
mold transitioning from the substantially rigid state to a
substantially flexible state upon application of the input.
Inventors: |
Oster; Sasha N.; (Chandler,
AZ) ; Sankman; Robert L.; (Phoenix, AZ) ;
Gealer; Charles; (Phoenix, AZ) ; Karhade; Omkar;
(Chandler, AZ) ; Guzek; John S.; (Chandler,
AZ) ; Mahajan; Ravindranath V.; (Chandler, AZ)
; Matayabas, JR.; James C.; (Chandler, AZ) ; Swan;
Johanna M.; (Scottsdale, AZ) ; Eid; Feras;
(Chandler, AZ) ; Liff; Shawna; (Gilbert, AZ)
; McIntosh; Timothy; (Phoenix, AZ) ; Kamgaing;
Telesphor; (Chandler, AZ) ; Elsherbini; Adel A.;
(Chandler, AZ) ; Aygun; Kemal; (Tempe,
AZ) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Intel Corporation |
Santa Clara |
CA |
US |
|
|
Family ID: |
53185403 |
Appl. No.: |
15/810800 |
Filed: |
November 13, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14102676 |
Dec 11, 2013 |
9820384 |
|
|
15810800 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/568 20130101;
H01L 2224/12105 20130101; H01L 24/19 20130101; G06F 1/163 20130101;
H05K 1/181 20130101; H01L 2924/18162 20130101; H05K 1/0393
20130101; H01L 2924/181 20130101; Y10T 29/49146 20150115; H05K
13/0469 20130101; H01L 2924/12042 20130101; H01L 2224/24137
20130101; H05K 1/189 20130101; H05K 2203/1469 20130101; H01L
2224/04105 20130101; H01L 24/96 20130101; H05K 1/185 20130101; H05K
2201/0137 20130101; H01L 2924/181 20130101; H01L 2924/00 20130101;
H01L 2924/12042 20130101; H01L 2924/00 20130101 |
International
Class: |
H05K 1/18 20060101
H05K001/18; H01L 23/00 20060101 H01L023/00 |
Claims
1. (canceled)
2. An electronic assembly, comprising: a microelectronic component;
and a polymer mold encapsulating, at least in part, the
microelectronic component; wherein the polymer mold includes a
modulus reducing input at least partially interspersed within a
microstructure of the polymer.
3. The electronic assembly of claim 2, wherein the polymer mold
includes an interpenetrating polymer network.
4. The electronic assembly of claim 3, wherein the interpenetrating
polymer network includes a first network of macromolecules and a
second network of macromolecules, and wherein the input causes the
second network of macromolecules to at least partially dissolve
while leaving the first network of macromolecules substantially
intact.
5. The electronic assembly of claim 2, wherein the routing layer
further includes an insulator forming holes.
6. The electronic assembly of claim 5, wherein the holes are
grooves formed via at least one of embossing, etching, and
scribing.
7. The electronic assembly of claim 2, further comprising a
plurality of microelectronic components, wherein the
microelectronic component is one of the plurality of
microelectronic components.
8. The electronic assembly of claim 7, wherein at least some of the
microelectronic components are dies.
9. The electronic assembly of claim 2, further comprising a circuit
board, the traces of the routing layer being coupled to the circuit
board,
10. The electronic assembly of claim 9, wherein the circuit board
is a flexible circuit board.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of U.S. patent
application Ser. No. 14/102,676, filed Dec. 11, 2013, now issued as
U.S. Pat. No. 9,820,384, which is incorporated by reference herein
in its entirety.
TECHNICAL FIELD
[0002] The disclosure herein relates generally to flexible
electronic assembly and related method therefor.
BACKGROUND
[0003] Certain electronic assemblies conventionally include
electronic or microelectronic components placed on a circuit board.
The electronic or microelectronic components (herein after
"electronic components," without limitation) may include a
semiconductor, such as a silicon die, encapsulated in a polymer and
coupled to routing circuitry to form a chip package. The chip
package may then be mechanically and communicatively coupled to a
circuit board, over which the chip package may communicate with
other electronic components.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 is an abstract depiction of a flexible electronic
assembly, in an example embodiment.
[0005] FIGS. 2A and 2B are abstract images of an interpenetrating
polymer network and its chemical bonds in a rigid and in a flexible
state, respectively, in an example embodiment.
[0006] FIGS. 3A-3H show a process for forming a flexible electronic
assembly, in an example embodiment.
[0007] FIGS. 4A and 4B are depictions of examples of a flexible
electronic devices, each including multiple component stacks, in
example embodiments.
[0008] FIG. 5 shows a flexible electronic device configured as a
wearable electronic device, in an example embodiment.
[0009] FIG. 6 is a flowchart for making a flexible electronic
assembly, in an example embodiment.
[0010] FIG. 7 is a block diagram of an electronic device
incorporating at least one microelectronic assembly, in an example
embodiment.
DESCRIPTION OF EMBODIMENTS
[0011] The following description and the drawings sufficiently
illustrate specific embodiments to enable those skilled in the art
to practice them. Other embodiments may incorporate structural,
logical, electrical, process, and other changes. Portions and
features of some embodiments may be included in, or substituted
for, those of other embodiments. Embodiments set forth in the
claims encompass all available equivalents of those claims.
[0012] Electronic assemblies are often substantially rigid owing,
at least in part, to the components that make up the assemblies.
The semiconductors, such as silicon dies, and encapsulants that are
often used may be substantially inflexible and may themselves be
attached to an inflexible circuit board. Even when the circuit
board or other substrate is flexible, the electronic assembly as a
whole may be inflexible around the electronic components.
[0013] An electronic assembly has been developed that incorporates
one or more elements to promote flexibility. In an example, a
flexible interpenetrating polymer network may be utilized in
molding electronic components for the assembly. The
interpenetrating polymer network may be processed in a
substantially rigid state and transitioned to a flexible state. In
an example, the mold assembly may be subjected to a thinning
process to allow the silicon die to bend. In an example, dielectric
layers of the electronic component may be provided with strain
relief through a scribing and/or embossing process. In an example,
a dielectric used in building the electronic component may have a
low modulus to promote bendability.
[0014] FIG. 1 is an abstract depiction of a flexible electronic
assembly 100, in an example embodiment. The electronic assembly 100
includes a circuit board 102 with multiple pads 104. The pads 104
are coupled to solder balls 106 of a microelectronic assembly 108.
As illustrated, the microelectronic assembly 108 includes multiple
microelectronic components, such as dies 110, at least partially
encapsulated in a mold 112.. The dies 110 receive input and output
via a routing layer 114 that includes traces 116 that couple the
dies 110 to the solder balls 106. While the disclosure herein will
refer to dies 110, it is to be recognized and understood that the
dies 110 may be substituted for or included with microelectronic
components generally, and that the various microelectronic
components may be implemented according to the same or essentially
the same principles disclosed herein. The microelectronic
components may be or include, in addition or in the alternative to
the dies 110, discrete microelectronic components, such as
capacitors, resistors, transistors, and the like, and/or may be or
include a prepackaged die or chip assembly.
[0015] It is to be understood that the electronic assembly 100 is
purely illustrative and that many configurations of the electronic
assembly 1.00 are contemplated. The microelectronic assembly 108
may include only a single die 110, the mold 112 may encapsulate the
dies 110 to a greater or lesser extent, the microelectronic
assembly 108 may include pads 104 rather than solder balls 106
while the circuit board may include solder balls 106 rather than
pads 104, and so forth. It is to be understood that the electronic
assembly 100 is generally scalable and configurable in various ways
that remain consistent with the systems and processes disclosed
herein. Further, while the electronic assembly 100 is described as
an electronic assembly in contrast with the microelectronic
assembly, it is to be understood that the electronic assembly 100
may itself be a microelectronic assembly and the microelectronic
assembly 108 simply a subcomponent of the larger microelectronic
assembly 100. Similarly, the microelectronic assembly 108 may be an
electronic assembly, with such an electronic assembly 108 being
part of the larger electronic assembly 100.
[0016] In various examples, the mold 112 is a polymer or a
relatively soft, pliable material suitable for molding generally.
In certain examples, the polymer is an interpenetrating polymer
network (IPN). The IPN may be applied to the microelectronic
assembly 108 in a substantially rigid form and then later processed
to become substantially flexible. In various examples, the mold 112
is any material which may transition from a substantially rigid
state to a substantially flexible state that includes the
electrical and mechanical properties suitable for encapsulating, at
least in part, the die 110. The various materials may transition
based on an input to the material, such as from a chemical, such as
a solvent, radiation, such as infrared or ultraviolet radiation, or
temperature.
[0017] FIGS. 2A and 2B are abstract images of an 1PN 200 and its
chemical bonds in a rigid and in a flexible state, respectively.
The image may depict a microstructure of the IPN 200 in the
respective rigid and flexible states. As noted above, the IPN may
be applied to the electronic assembly 100 in the rigid state and
then transitioned into the flexible state. Depending on the
specific IPN 200, the transformation may be effected by a chemical
process, by the application of a laser, irradiation, or thermal
energy, or by any of a variety of other processes, alone or in
combination.
[0018] In an example, the IPN 200 is a flexible epoxy network that
is covalently cross-linked with high molecular weight
macromolecules between cross-links. Relatively long segments
between cross-links may provide relatively high free-volume and
relatively low modulus and flexibility. The cross-links could be
both chemical or physical. Where the cross-link is physical, the
link may be thermally reversible.
[0019] FIG. 2A shows the IPN 200 in the rigid state. The 1PN 200
includes covalent bonds 202 between a first network of
macromolecules 204 and a second network of macromolecules 206. The
first network 204 is physically entangled with the second network
206, filling or substantially filling a free volume of the IPN 200.
Thus, in an example, the second network 206 may dissolve at the
application of, for instance, a solvent (among various potential
inputs, as disclosed herein) that may leave the first network 204
fully or substantially chemically unaffected.
[0020] Solvents may be selected that dissolve, at least in part,
the second network 206 while leaving the first network 204
completely or substantially intact. In an example, the solvent may
be water where the second network 206 is one of polyethylene oxide
or polypropylene oxide. In an alternative example, the solvent may
be N-methyl-2-pyrrolidone.
[0021] FIG. 2B shows the 200 in the flexible state following the
application of a solvent, in the above example. With the
application of the solvent, the second network 206 is dissolved
leaving the first network 204 held together with the bonds 202. In
an example, the bonds 202 are semi-permanent.
[0022] The IPN 200 may be a polyurethane, silane, acrylic, or
polyimide, among numerous others polymer types. The IPN 200 may be
physically entangled within the first network 204 and may have
physical or chemical cross-links to itself. In an example, where
the second network 206 is a polyurethane, the second network 206 it
may be physically cross-linked to itself via hydrogen bonding and
distinct and separate from the first network 204, such as when the
first network 204 is an epoxy. Upon application of various
solvents, such as dimethyl formatnide, dimethyl acetamide, and/or
tetrahydrofuran, the polyurethane second network 206 may be
dissolved and removed from the epoxy first network 204 with minimal
damage to the epoxy first network 204.
[0023] In various examples, the second network 206 may too contain
cross-links to the first network 204. However; these links may be
reversible, such as through thermal or irradiative treatment, and
may enable a majority of the second network 206 to then be removed
through chemical exposure. For example cross-links may be
reversibly switched upon exposure to light at various wavelengths
(photo-switchable) or cleaved (photo-cleaved). In various examples,
an entirety of the second network 206 does not to be removed for
the polymeric material to transition the IPN 200 from rigid to
flexible.
[0024] FIGS. 3A-3H show a process for forming a flexible electronic
assembly. In various examples, the process may form the flexible
electronic assembly 100. Various steps of the process are optional
and are not necessarily used to make a flexible electronic
assembly, as appropriate. While the process detailed herein will be
described with respect to certain components of the flexible
electronic assembly 100 above, it is to be understood that the
various components may be substituted for or replaced by
alternative components, including alternative components of the
same type as the components described with respect to the flexible
electronic assembly 100.
[0025] In FIG. 3A, connectors 300 of multiple dies 110 are placed
face down on an adhesive foil layer 302 coupled to a carrier 304.
The dies 110 themselves may be adhered to the foil layer 302 in
addition to or instead of the connectors 300. In general, the
adhesive foil layer 302 in combination with the carrier 304 may
serve to fix the dies 110 with respect to one another for further
process steps. It is to be understood that the adhesive foil layer
302 and the carrier 304 may be any materials and/or structures that
may secure the dies 110 with respect to one another and support
further process steps. It is also to be understood that only a
single die 110 may be utilized in various examples.
[0026] In FIG. 3B, a mold 306 is formed over the dies 110 and
optionally cured, such as to provide rigidity. The mold 306 may
ultimately be formed into the mold 112 disclosed herein in future
process steps. The mold 306 may be formed from the same or similar
materials as disclosed herein, including a polymer and,
specifically, a full- or semi-IPN. While the mold 306 as
illustrated envelops the dies 110, it is to be understood that the
mold 306 may be formed in such a way as to be substantially
coextensive with the height of the dies 110, as is the case with
the mold 112.
[0027] In FIG. 3C, the mold 306 is optionally ground back to be
substantially coextensive with a height of the dies 110. In an
example in which the dies 110 (or microelectronic components
generally) have different heights, the mold 306 is ground back to
be substantially coextensive with a height of a tallest one of the
dies/microelectronic components 110. In various examples, the mold
306 takes on the form of the mold 112, The mold 306 is not
necessarily ground down, but doing so may reduce an overall height
of the microelectronic assembly 108 because the height of the mold
306 may be the same or essentially the same as the height of the
dies 110.
[0028] In FIG. 3D, the adhesive foil layer 302 and carrier 304 is
removed and the dies 110 and mold 306 are flipped. The adhesive
foil layer 302 may be removed by peeling the foil layer 302 from
the dies 110 or by any suitable method. Flipping the dies 110 and
mold 306 does not necessarily change a physical state of the dies
110 and mold 306 except to change their relative orientation for
future process steps, as detailed herein.
[0029] In FIG. 3E, the routing layer 114 and solder balls 106 are
applied to the dies 110 and mold 306 to form a microelectronic
assembly 308. The microelectronic assembly 308 may be the same as
or similar to the microelectronic assembly 108. The routing layer
114 may be formed according to any of a variety of techniques or
processes and with any of a variety of materials. In an example,
the traces 116 of the routing layer are formed from copper and an
insulator 310. The copper traces 116 and layers of the insulator
310 may be progressively added until the routing layer 114 as a
whole is formed. Alternatively, the copper traces 116 may be formed
and the insulator 310 formed around the traces 116. Additional or
alternative processes may be implemented.
[0030] In FIG. 3F, the insulator 310 of the routing layer 114 is
optionally scribed or embossed with grooves 312 to increase
flexibility and provide strain relief, at least in part. In various
examples, the grooves 312 are generally holes formed in the
insulator 310 and may alternatively be dimples or other voids in
the insulator that may provide strain relief. The grooves 312 may
be formed according to any of a variety of laser etching, chemical
patterning and/or etching, routing, cutting, or embossing
techniques. The resulting routing layer 114 may be relatively more
flexible than a routing layer 114 without the grooves 312. The
grooves 312 may be any of a variety of configurations, including
widths and depths, as desired and as may be supported by the
overall structure of the routing layer 114. Thus, the grooves 312
may be as deep and as broad as the routing layer 114 may
support.
[0031] In FIG. 3G, the mold 306 is exposed to a solvent or other
input to remove one component of the IPN 200 to reduce a modulus of
the IPN 200 and increase flexibility, as disclosed above. In
certain examples, the mold 306 is optionally exposed to the
solvent. The resulting microelectronic assembly 308 may be
consequently be relatively more flexible than if the mold 306
weren't processed as in this step or if the routing layer 114
didn't have grooves 312.
[0032] In FIG. 3H, the circuit board 102 is coupled to the
microelectronic assembly 308 to form a flexible electronic assembly
314. The solder balls 106 may be soldered to the pads 104 to
mechanically and electrically couple the circuit board 102. to the
microelectronic assembly 308. In various examples, alternative
assembly processes, such as using anisotropic conducting film (ACF)
or anisotropic conducting paste (ACP). As noted above, the circuit
board 102 may be a flexible circuit board to promote the general
flexibility of the flexible electronic assembly 314. The process
disclosed herein may be in a variety of sequences, as appropriate.
In an example, the step of FIG. 3G may optionally be performed
prior to the step of FIG, 3F.
[0033] FIGS. 4A and 4B are depictions of examples of a flexible
electronic devices 400A, 400B (collectively "devices 400"), each
including multiple component stacks 402. The devices 400 include a
flexible base layer 404, such as a flexible circuit board or cable,
as disclosed herein. In various examples, the component stacks 402
are or include the microelectronic assemblies 108, 308 as disclosed
herein and the base layer 404 is the circuit board 102 as disclosed
herein. Alternatively, the electronic assemblies 100, 314 are the
component stacks 402 and are coupled to the flexible base layer
404. Alternatively, the component stacks 402 are not related to the
electronic assemblies 100, 314.
[0034] The flexible base layer 404 may include a single layer 406
incorporating conductive lines 408, such as traces and/or a power
bus. The single layer 406 may be a flexible substrate and the
conductive lines 408 may be sufficiently thin to promote overall
flexibility of the flexible base layer 404 and the electronic
devices 400 generally.
[0035] The component stacks 402 include multiple layers 410. The
layers 410 may include any one or more of the circuit board 102,
the die 110, the mold 112, and the routing layer 114. The layers
410 may include additional or alternative electronic component
layers that may be desired to be included in the flexible
electronic devices 400. As noted above, the component stacks 402
optionally do not include any of the components of the electronic
assemblies 100, 314.
[0036] In general, the single layer 406 of the flexible base layer
404 may promote general flexibility of the devices 400 while the
component stacks 402 may be relatively less flexible than the base
layer 404 owing, at least in part to the multiple layers 410 of the
stack 402. The stacks 402 are separated by gaps 412 in which an
electronic component thickness of the devices 400 is only or
essentially only the thickness of the flexible base layer 404,
i.e., the thickness of the single layer 406. Thus, the electronic
devices may be relatively more flexible in the lateral regions
corresponding to the gaps 412 between the stacks 402 than in the
regions corresponding to the stacks 402 themselves. The presence of
the gaps 412, however, may promote the general and overall
flexibility of the devices 400.
[0037] The devices 400A, 400B each include an overmold 414A, 414B,
respectively (collectively, overmolds 414). The overmolds 414 may
be molded from a flexible polymer or other suitable material. The
overmolds 414 may encapsulate and substantially protect the
component stacks 202 and flexible base layer 404.
[0038] The overmold 414A is essentially uniform and of a
substantially constant height 416 while the overmold 414B includes
grooves 418 as illustrated. The grooves 418 may be formed from a
mold which is used to create the overmold 414B or may be carved,
scribed, embossed, or otherwise cut out of an overmold, such as the
overmold 414A. The grooves 414B may promote flexibility in the
flexible electronic device 400B.
[0039] FIG. 5 shows a flexible electronic device configured as a
wearable electronic device 500. As illustrated, the wearable
electronic device 500 is based on the flexible electronic device
400A, though it is to be understood that a wearable electronic
device may be formed from the flexible electronic device 400B as
well as any other suitable flexible electronic device.
[0040] The wearable electronic device 500 is configured, in various
examples, to be worn as a ring, a wrist or ankle bracelet, or other
piece of wearable clothing or accessory. In such examples, the
wearable electronic device 500 may be sized as appropriate for
conventional sizes of such articles. The overmold 414A and/or the
flexible base layer 404 may be biased to retain the general shape
of the wearable electronic device 500, as illustrated a ring. It is
to be recognized that, while a ring shape is illustrated, the
wearable electronic device 500 may be formed into any of a variety
of shapes and configurations, The wearable electronic device 500
may maintain its general flexibility, thus allowing the wearable
electronic device 500 to be flexed straight or into any of a
variety of configurations. The bias on the wearable electronic
device 500 may cause the wearable electronic deice 500 to return to
its biased shape upon the removal of a flexing pressure or
force.
[0041] The wearable electronic device 500 may incorporate any
suitable electronic function that may be implemented by electronics
in the component stacks 402. The component stacks 402 may be
mounted on the flexible base layer 404 using embedded die
technology, wire bonding, a chip attach module (CAM) or flip-chip
reflow, or thermal compression bonding, among other suitable
methods. The flexible base layer 404 may include discrete
components, such as chip antennas and a crystal. Coplanar
waveguides may be used to reduce signal interference on the
conductive lines 408. A chip or planar integrated antenna may be
formed from the conductive lines 408.
[0042] In an example, the flexible base layer 404 is built
monolithically using an embedded die or build-up layer process.
Alternatively, discrete components of the stacks 402 are assembled
on the flexible base layer 404 using flip-chp assembly or thermal
compression bonding. Alternatively, the stacks 402 are formed
separately and then mounted on the flexible base layer 404. The
overmold 414 may then be molded on top of the sack 402 and base
layer 404 combination. A photodefinable dielectric may be utilized
to facilitate removal of dielectric material in the gaps 412.
[0043] FIG. 6 is a flowchart for building a flexible
microelectronic assembly, in an example embodiment. The flowchart
may be utilized to make microelectronic assemblies disclosed herein
or any of a variety of suitable microelectronic assemblies.
[0044] At 600, microelectronic components are optionally secured
with respect to one another with an adhesive foil and a
carrier.
[0045] At 602, a polymer mold is molded over a microelectronic
component, the polymer mold assuming a substantially rigid state
following the molding. In an example, the polymer mold is formed,
at least in part, from an interpenetrating polymer network. In an
example, the interpenetrating polymer network includes a first
network of macromolecules and a second network of macromolecules,
and wherein the input causes the second network of macromolecules
to at least partially dissolve while leaving the first network of
macromolecules substantially intact. In an example, molding the
polymer mold includes molding the polymer mold over a plurality of
microelectronic components. In an example, at least some of the
microelectronic components are dies. In an example, applying the
polymer mold includes surrounding the microelectronic components
and contacting the adhesive foil with the polymer mold.
[0046] At 604, some of the polymer mold is optionally removed so
that a height of the polymer mold is approximately coextensive with
a height of the microelectronic component.
[0047] At 606, the adhesive foil and the carrier are optionally
removed.
[0048] At 608, a routing layer is formed with respect to the
microelectronic component and the polymer mold, the routing layer
including traces electrically coupled to the microelectronic
component. In an example, the routing layer further includes an
insulator, and further comprising forming holes in the insulator.
In an example, the holes are grooves and wherein forming the
grooves includes at least one of embossing, etching, and
scribing.
[0049] At 610, an input is applied to the polymer mold, the polymer
mold transitioning from the substantially rigid state to a
substantially flexible state upon application of the input. In an
example, the input is at least one of a solvent, an increase in
ambient temperature, and radiation. In an example, the radiation is
at least one of infrared radiation and ultraviolet radiation.
[0050] At 612, the traces of the routing layer are optionally
coupled to a circuit board. In an example, the circuit board is a
flexible circuit board.
[0051] An example of an electronic device using electronic
assemblies as described in the present disclosure is included to
show an example of a higher level device application for the
disclosed subject matter. FIG. 7 is a block diagram of an
electronic device 700 incorporating at least one microelectronic
assembly, such as a microelectronic assembly 100, 400 or other
microelectronic assembly described in examples herein. The
electronic device 700 is merely one example of an electronic system
in which embodiments of the present invention can be used. Examples
of electronic devices 700 include, but are not limited to personal
computers, tablet computers, mobile telephones, personal data
assistants, MP3 or other digital music players, wearable devices,
etc. In this example, the electronic device 700 comprises a data
processing system that includes a system bus 702 to couple the
various components of the system. The system bus 702 provides
communications links among the various components of the electronic
device 700 and can be implemented as a single bus, as a combination
of busses, or in any other suitable manner.
[0052] An electronic assembly 710 is coupled to the system bus 702.
The electronic assembly 710 can include any circuit or combination
of circuits. In one embodiment, the electronic assembly 710
includes a processor 712 which can be of any type. As used herein,
"processor" means any type of computational circuit, such as but
not limited to a microprocessor, a microcontroller, a complex
instruction set computing (CISC) microprocessor, a reduced
instruction set computing (RISC) microprocessor, a very long
instruction word (VLIW) microprocessor, a graphics processor, a
digital signal processor (DSP), multiple core processor, or any
other type of processor or processing circuit.
[0053] Other types of circuits that can be included in the
electronic assembly 710 are a custom circuit, an
application-specific integrated circuit (ASIC), or the like, such
as, for example, one or more circuits (such as a communications
circuit 714) for use in wireless devices like mobile telephones,
pagers, personal data assistants, portable computers, two-way
radios, wearable device, and similar electronic systems. The IC can
perform any other type of function.
[0054] The electronic device 700 can also include an external
memory 720, which in turn can include one or more memory elements
suitable to the particular application, such as a main memory 722
in the form of random access memory (RAM), one or more hard drives
724, and/or one or more drives that handle removable media 726 such
as compact disks (CI)), digital video disk (DVD), and the like.
[0055] The electronic device 700 can also include a display device
716, one or more speakers 718, and a keyboard and/or controller
730, which can include a mouse, trackball, touch screen,
voice-recognition device, or any other device that permits a system
user to input information into and receive information from the
electronic device 700.
ADDITIONAL EXAMPLES
[0056] Example 1 may include subject matter (such as an apparatus,
a method, a means for performing acts) that can include molding a
polymer mold over a microelectronic component, the polymer mold
assuming a substantially rigid state following the molding, forming
a routing layer with respect to the microelectronic component and
the polymer mold, the routing layer including traces electrically
coupled to the microelectronic component, and applying an input to
the polymer mold, the polymer mold transitioning from the
substantially rigid state to a substantially flexible state upon
application of the input.
[0057] In Example 2, the method of Example 1 optionally further
includes that the input is at least one of a solvent, an increase
in ambient temperature, and radiation.
[0058] In Example 3, the method of any one or more of Examples 1
and 2 optionally further includes that the radiation is at least
one of infrared radiation and ultraviolet radiation.
[0059] In Example 4, the method of any one or more of Examples 1-3
optionally further includes that the polymer mold is formed, at
least in part, from an interpenetrating polymer network.
[0060] In Example 5, the method of any one or more of Examples 1-4
optionally further includes that the interpenetrating polymer
network includes a first network of macromolecules and a second
network of macromolecules, and that the input causes the second
network of macromolecules to at least partially dissolve while
leaving the first network of macromolecules substantially
intact.
[0061] In Example 6, the method of any one or more of Examples 1-5
optionally further includes that the routing layer further includes
an insulator, and further comprising forming holes in the
insulator.
[0062] In Example 7, the method of any one or more of Examples 1-6
optionally further includes that the holes are grooves and wherein
forming the grooves includes at least one of embossing, etching,
and scribing.
[0063] In Example 8, the method of any one or more of Examples 1-7
optionally further includes that the molding the polymer mold
includes molding the polymer mold over a plurality of
microelectronic components.
[0064] In Example 9, the method of any one or more of Examples 1-8
optionally further includes that at least some of the
microelectronic components are dies.
[0065] In Example 10, the method of any one or more of Examples 1-9
optionally further includes securing the microelectronic components
with respect to one another with an adhesive foil and a carrier,
wherein applying the polymer mold comprises surrounding the
microelectronic components and contacting the adhesive foil with
the polymer mold.
[0066] In Example 11, the method of any one or more of Examples
1-10 optionally further includes removing the adhesive foil and the
carrier prior to forming the routing layer.
[0067] In Example 12, the method of any one or more of Examples
1-11 optionally further includes removing some of the polymer mold
so that a height of the polymer mold is approximately coextensive
with a height of the microelectronic component.
[0068] In Example 13, the method of any one or more of Examples
1-12 optionally further includes coupling the traces of the routing
layer to a circuit board.
[0069] In Example 14, the method of any one or more of Examples
1-13 optionally further includes that the circuit board is a
flexible circuit board
[0070] Example 15 may include subject matter (such as an apparatus,
a method, a means for performing acts) that can include a
microelectronic component and a polymer mold encapsulating, at
least in part, the microelectronic component, wherein the polymer
mold includes a modulus reducing input at least partially
interspersed within a microstructure of the polymer.
[0071] In Example 16, the electronic assembly of Example 15
optionally further includes that the polymer mold includes an
interpenetrating polymer network.
[0072] In Example 17, the electronic assembly of any one or more of
Examples 15 and 16 optionally further includes that the
interpenetrating polymer network includes a first network of
macromolecules and a second network of macromolecules, and wherein
the input causes the second network of macromolecules to at least
partially dissolve while leaving the first network of
macromolecules substantially intact.
[0073] In Example 18, the electronic assembly of any one or more of
Examples 15-17 optionally further includes that the routing layer
further includes an insulator forming holes.
[0074] In Example 19, the electronic assembly of any one or more of
Examples 15-18 optionally further includes that the holes are
grooves formed via at least one of embossing, etching, and
scribing.
[0075] In Example 20, the electronic assembly of any one or more of
Examples 15-19 optionally further includes a plurality of
microelectronic components, wherein the microelectronic component
is one of the plurality of microelectronic components.
[0076] In Example 21, the electronic assembly of any one or more of
Examples 15-20 optionally further includes that at least some of
the microelectronic components are dies.
[0077] In Example 22, the electronic assembly of any one or more of
Examples 15-21 optionally further includes that a circuit board,
the traces of the routing layer being coupled to the circuit
board.
[0078] In Example 23, the electronic assembly of any one or more of
Examples 15-22 optionally further includes that the circuit board
is a flexible circuit board.
[0079] Example 24 may include subject matter (such as an apparatus,
a method, a means for performing acts) that can include a flexible
base layer comprising only a single layer, and a plurality of
component stacks coupled to the base layer, each of the plurality
of component stacks comprising a microelectronic component and a
polymer mold encapsulating, at least in part, the microelectronic
component, wherein the polymer mold includes a modulus reducing
input at least partially interspersed within a microstructure of
the polymer.
[0080] In Example 25, the electronic assembly of Example 24
optionally further includes that the polymer mold includes an
overmold encapsulating, at least in part, the plurality of
component stacks.
[0081] In Example 26, the electronic assembly of any one or more of
Examples 24 and 25 optionally further includes that the overmold
forms grooves at least partially between individual ones of the
component stacks.
[0082] In Example 27, the electronic assembly of any one or more of
Examples 24-26 optionally further includes that the flexible base
layer is biased in a form configured to he wearable by a
person.
[0083] In Example 28, the electronic assembly of any one or more of
Examples 24-27 optionally further includes that the electronic
assembly is biased to form at least a partial ring.
[0084] Each of these non-limiting examples can stand on its own, or
can be combined with one or more of the other examples in any
permutation or combination.
[0085] The above detailed description includes references to the
accompanying drawings, which form a part of the detailed
description. The drawings show, by way of illustration, specific
embodiments in which the invention can be practiced. These
embodiments are also referred to herein as "examples." Such
examples can include elements in addition to those shown or
described. However, the present inventors also contemplate examples
in which only those elements shown or described are provided.
Moreover, the present inventors also contemplate examples using any
combination or permutation of those elements shown or described (or
one or more aspects thereof), either with respect to a particular
example (or one or more aspects thereof), or with respect to other
examples (or one or more aspects thereof) shown or described
herein.
[0086] In this document, the terms "a" or "an" are used, as is
common in patent documents, to include one or more than one,
independent of any other instances or usages of "at least one" or
"one or more." In this document, the term "or" is used to refer to
a nonexclusive or, such that "A or B" includes "A but not B," "B
but not A," and "A and B," unless otherwise indicated. In this
document, the terms "including" and "in which" are used as the
plain-English equivalents of the respective terms "comprising" and
"wherein." Also, in the following claims, the terms "including" and
"comprising" are open-ended, that is, a system, device, article,
composition, formulation, or process that includes elements in
addition to those listed after such a term in a claim are still
deemed to fall within the scope of that claim. Moreover, in the
following claims, the terms "first," "second," and "third," etc.
are used merely as labels, and are not intended to impose numerical
requirements on their objects.
[0087] The above description is intended to be illustrative, and
not restrictive. For example, the above-described examples (or one
or more aspects thereof) may be used in combination with each
other. Other embodiments can be used, such as by one of ordinary
skill in the art upon reviewing the above description. The Abstract
is provided to comply with 37 C.F.R. .sctn. 1.72(b), to allow the
reader to quickly ascertain the nature of the technical disclosure.
It is submitted with the understanding that it will not be used to
interpret or limit the scope or meaning of the claims. Also, in the
above Detailed Description, various features may be grouped
together to streamline the disclosure. This should not be
interpreted as intending that an unclaimed disclosed feature is
essential to any claim. Rather, inventive subject matter may lie in
less than all features of a particular disclosed embodiment, Thus,
the following claims are hereby incorporated into the Detailed
Description, with each claim standing on its own as a separate
embodiment, and it is contemplated that such embodiments can be
combined with each other in various combinations or permutations.
The scope of the invention should be determined with reference to
the appended claims, along with the full scope of equivalents to
which such claims are entitled.
* * * * *