Matayabas, Jr.; James C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Matayabas, Jr.; James C..The latest application filed is for "carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds".

Company Profile

11.53.43

Matayabas, Jr.; James C. - Gilbert AZ
Matayabas, JR.; James C. - Chandler AZ
Matayabas, JR.; James C. - Gilber AZ
Matayabas, Jr.; James C. - Canton GA
Matayabas, Jr.; James C - Chandler AZ
Matayabas, Jr.; James C. - Kingsport TN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-chip packages and sinterable paste for use with thermal interface materials Grant 11,404,349 - Raravikar , et al. August 2, 2	2022-08-02
Microelectronic package having electromagnetic interference shielding Grant 11,189,574 - Weng , et al. November 30, 2	2021-11-30
Carbon Based Polymer Thermal Interface Materials With Polymer Chain To Carbon Based Fill Particle Bonds App 20210265238 - Tejeda Ferrari; Marely E. ; et al.	2021-08-26
Microelectronic Package Having Electromagnetic Interference Shielding App 20210118809 - Weng; Li-Sheng ; et al.	2021-04-22
Integrated Heat Spreader With Enhanced Vapor Chamber For Multichip Packages App 20200350229 - Chang; Je-Young ; et al.	2020-11-05
Carbon-pad Thermal-interface Materials In Multi-die Packages App 20200286809 - Gong; Shushan ; et al.	2020-09-10
Integrated Heat Spreader Comprising A Silver And Sintering Silver Layered Structure App 20200286806 - Nofen; Elizabeth ; et al.	2020-09-10
Ic Die Package Thermal Spreader And Emi Shield Comprising Graphite App 20200273811 - Mallik; Debendra ; et al.	2020-08-27
Thermal Management Solutions For Integrated Circuit Packages App 20200227332 - Singh; Kumar Abhishek ; et al.	2020-07-16
LPS solder paste based low cost fine pitch pop interconnect solutions Grant 10,586,779 - Raravikar , et al.	2020-03-10
Multiple-chip package with multiple thermal interface materials Grant 10,580,717 - Liu , et al.	2020-03-03
Multi-chip Packages And Sinterable Paste For Use With Thermal Interface Materials App 20190267306 - RARAVIKAR; Nachiket R. ; et al.	2019-08-29
Compressible Media Applicator, Application System And Methods For Same App 20190099776 - Hackenberg; Ken P. ; et al.	2019-04-04
Compressible Media Applicator, Application System And Methods For Same App 20190099777 - Hackenberg; Ken P. ; et al.	2019-04-04
Cooling Solution Designs For Microelectronic Packages App 20190006259 - Padmanabhan Ramalekshmi Thanu; Dinesh ; et al.	2019-01-03
Multiple-chip Package With Multiple Thermal Interface Materials App 20180374776 - LIU; Boxi ; et al.	2018-12-27
Adhesive Polymer Thermal Interface Material With Sintered Fillers For Thermal Conductivity In Micro-electronic Packaging App 20180323130 - LIU; Boxi ; et al.	2018-11-08
Processes And Methods For Applying Underfill To Singulated Die App 20180286704 - Nofen; Elizabeth M. ; et al.	2018-10-04
Flexible Electronic Assembly Method App 20180263117 - Oster; Sasha N. ; et al.	2018-09-13
Hybrid Low Metal Loading Flux App 20180236609 - SIDHU; Rajen S. ; et al.	2018-08-23
Polymer thermal interface material having enhanced thermal conductivity Grant 10,056,314 - Lowe, Jr. , et al. August 21, 2	2018-08-21
Hybrid low metal loading flux Grant 9,950,393 - Sidhu , et al. April 24, 2	2018-04-24
Space transformer with perforated metallic plate for electrical die test Grant 9,941,652 - Raravikar , et al. April 10, 2	2018-04-10
Energy Storage Material For Thermal Management And Associated Techniques And Configurations App 20180068926 - KRAJNIAK; JAN ; et al.	2018-03-08
Lps Solder Paste Based Low Cost Fine Pitch Pop Interconnect Solutions App 20180047693 - RARAVIKAR; Nachiket R. ; et al.	2018-02-15
LPS solder paste based low cost fine pitch pop interconnect solutions Grant 9,831,206 - Raravikar , et al. November 28, 2	2017-11-28
Flexible electronic assembly method Grant 9,820,384 - Oster , et al. November 14, 2	2017-11-14
Space Transformer Including A Perforated Mold Preform For Electrical Die Test App 20170176496 - Mathkar; Akshay ; et al.	2017-06-22
Space Transformer With Perforated Metallic Plate For Electrical Die Test App 20170176518 - Raravikar; Nachiket R. ; et al.	2017-06-22
Thermoset polymides for microelectronic applications Grant 9,646,903 - Lehman, Jr. , et al. May 9, 2	2017-05-09
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials Grant 9,640,415 - Lowe, Jr. , et al. May 2, 2	2017-05-02
Package structure to enhance yield of TMI interconnections Grant 9,613,933 - De Bonis , et al. April 4, 2	2017-04-04
Controlled fluid delivery in a microelectronic package Grant 9,604,210 - Supriya , et al. March 28, 2	2017-03-28
Polymer Thermal Interface Material Having Enhanced Thermal Conductivity App 20150279762 - LOWE; Randall ; et al.	2015-10-01
Package Structure To Enhance Yield of TMI Interconnections App 20150255415 - De Bonis; Thomas J. ; et al.	2015-09-10
Controlled fluid delivery in a microelectronic package Grant 9,101,931 - Supriya , et al. August 11, 2	2015-08-11
Controlled Fluid Delivery In A Microelectronic Package App 20150209780 - Supriya; Lakshmi ; et al.	2015-07-30
Polymer thermal interface material having enhanced thermal conductivity Grant 9,070,660 - Lowe, Jr. , et al. June 30, 2	2015-06-30
Robust Ink Formulations For Durable Markings On Microelectronic Packages And Its Extendibility As A Barrier Material For Thermal And Sealant Materials App 20150166804 - Lowe, JR.; Randall D. ; et al.	2015-06-18
Flexible Electronic Assembly And Method App 20150163921 - Oster; Sasha ; et al.	2015-06-11
Thermal interface material composition including polymeric matrix and carbon filler Grant 8,920,919 - Arora , et al. December 30, 2	2014-12-30
Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin Grant 8,901,716 - Matayabas, Jr. December 2, 2	2014-12-02
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials Grant 8,900,919 - Lowe, Jr. , et al. December 2, 2	2014-12-02
Robust Ink Formulations For Durable Markings On Microelectronic Packages And Its Extendibility As A Barrier Material For Thermal And Sealant Materials App 20140264957 - Lowe, JR.; Randall D. ; et al.	2014-09-18
Thermoset Polymides For Microelectronic Applications App 20140148557 - Lehman, JR.; Stephen E. ; et al.	2014-05-29
Thermal Interface Material Composition Including Polymeric Matrix And Carbon Filler App 20140087200 - ARORA; Hitesh ; et al.	2014-03-27
Thermoset polyimides for microelectronic applications Grant 8,643,199 - Lehman, Jr. , et al. February 4, 2	2014-02-04
Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications Grant 8,431,223 - Matayabas, Jr. , et al. April 30, 2	2013-04-30
Radiation curable compositions Grant 8,431,673 - Wang , et al. April 30, 2	2013-04-30
Low Coefficient Of Thermal Expansion (cte) Thermosetting Resins For Integrated Circuit Applications App 20120282462 - Matayabas, JR.; James C. ; et al.	2012-11-08
Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications Grant 8,242,216 - Matayabas, Jr. , et al. August 14, 2	2012-08-14
Low Coefficient Of Thermal Expansion (cte) Thermosetting Resins For Integrated Circuit Applications App 20110250458 - Matayabas, JR.; James C. ; et al.	2011-10-13
Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications Grant 7,999,042 - Matayabas, Jr. , et al. August 16, 2	2011-08-16
Radiation Curable Compositions App 20110028641 - Wang; Zhikai Jeffrey ; et al.	2011-02-03
Component packaging apparatus, systems, and methods Grant 7,816,171 - Koning , et al. October 19, 2	2010-10-19
Dielectric Film With Low Coefficient Of Thermal Expansion (cte) Using Liquid Crystalline Resin App 20100213581 - Matayabas, JR.; James C.	2010-08-26
Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin Grant 7,744,802 - Matayabas, Jr. June 29, 2	2010-06-29
In-situ functionalization of carbon nanotubes Grant 7,700,943 - Raravikar , et al. April 20, 2	2010-04-20
Chain extension for thermal materials Grant 7,671,120 - Matayabas, Jr. March 2, 2	2010-03-02
Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance Grant 7,666,768 - Raravikar , et al. February 23, 2	2010-02-23
Formation of holes in substrates using dewetting coatings Grant 7,611,985 - Matayabas, Jr. , et al. November 3, 2	2009-11-03
Controlled Fluid Delivery In A Microelectronic Package App 20090169427 - Supriya; Lakshmi ; et al.	2009-07-02
Thermoset Polyimides For Microelectronic Applications App 20090146289 - Lehman, JR.; Stephen E. ; et al.	2009-06-11
Thermoset polyimides for microelectronic applications Grant 7,534,649 - Lehman, Jr. , et al. May 19, 2	2009-05-19
In-situ functionalization of carbon nanotubes Grant 7,465,605 - Raravikar , et al. December 16, 2	2008-12-16
In-situ Functionalization Of Carbon Nanotubes App 20080305321 - Raravikar; Nachiket R. ; et al.	2008-12-11
Polymer device with a nanocomposite barrier layer Grant 7,446,360 - Matayabas, Jr. , et al. November 4, 2	2008-11-04
Methods for fabricating thermal management systems for micro-components Grant 7,421,780 - Houle , et al. September 9, 2	2008-09-09
Component packaging apparatus, systems, and methods Grant 7,365,414 - Koning , et al. April 29, 2	2008-04-29
Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging Grant 7,224,050 - Matayabas, Jr. , et al. May 29, 2	2007-05-29
Package stress management Grant 7,179,689 - Matayabas, Jr. , et al. February 20, 2	2007-02-20
Package stress management Grant 7,170,188 - Matayabas, Jr. , et al. January 30, 2	2007-01-30
Chain extension for thermal materials Grant 7,060,747 - Matayabas, Jr. June 13, 2	2006-06-13
Thermal management systems for micro-components Grant 7,019,971 - Houle , et al. March 28, 2	2006-03-28
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials Grant 6,974,723 - Matayabas, Jr. , et al. December 13, 2	2005-12-13
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials Grant 6,841,867 - Matayabas, Jr. , et al. January 11, 2	2005-01-11
Electronic packages having good reliability comprising low modulus thermal interface materials Grant 6,597,575 - Matayabas, Jr. , et al. July 22, 2	2003-07-22
Chain extension for thermal materials Grant 6,469,379 - Matayabas, Jr. October 22, 2	2002-10-22
Polyether polymers derived from 3,4-epoxy-1-butene Grant 5,608,034 - Falling , et al. March 4, 1	1997-03-04

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